93LC56BX-I/SN Microchip Technology, 93LC56BX-I/SN Datasheet - Page 18

no-image

93LC56BX-I/SN

Manufacturer Part Number
93LC56BX-I/SN
Description
IC EEPROM 2KBIT 3MHZ 8SOIC
Manufacturer
Microchip Technology
Datasheets

Specifications of 93LC56BX-I/SN

Memory Size
2K (128 x 16)
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Speed
2MHz, 3MHz
Interface
Microwire, 3-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Memory Configuration
128 X 16
Ic Interface Type
Microwire
Clock Frequency
3MHz
Supply Voltage Range
2.5V To 5.5V
Memory Case Style
SOIC
No. Of Pins
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
93LC56BX-I/SNG
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
DS21794E-page 18
8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
A2
E1
E
Units
A1
E1
φ
A2
L1
N
A
E
D
α
e
h
L
φ
c
b
β
1.25
0.10
0.25
0.40
0.17
0.31
MIN
h
L
L1
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
Microchip Technology Drawing C04-057B
α
β
© 2007 Microchip Technology Inc.
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
c

Related parts for 93LC56BX-I/SN