AT24C02C-SSHM-B Atmel, AT24C02C-SSHM-B Datasheet - Page 15

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AT24C02C-SSHM-B

Manufacturer Part Number
AT24C02C-SSHM-B
Description
IC EEPROM 2KBIT 1MHZ 8SOIC
Manufacturer
Atmel
Datasheet

Specifications of AT24C02C-SSHM-B

Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
2K (256 x 8)
Speed
400kHz, 1MHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT24C02C-SSHM-B
Manufacturer:
ATMEL
Quantity:
21 400
Part Number:
AT24C02C-SSHM-B
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
8700D–SEEPR–8/10
11.
Ordering Codes
Atmel AT24C02C Ordering Information
Notes:
Ordering Code
AT24C02C-PUM (Bulk form only)
AT24C02C-SSHM-B
AT24C02C-SSHM-T
AT24C02C-XHM-B
AT24C02C-XHM-T
AT24C02C-MAHM-T
AT24C02C-STUM-T
AT24C02C-CUM-T
AT24C02C-WWU11
8P3
8S1
8A2
8Y6
5TS1
8U3-1
1. “-B” denotes bulk
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, UDFN, SOT23, and VFBGA = 5K per reel
3. For Wafer sales, please contact Atmel Sales
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00mm x 3.00mm Body, 0.50mm Pitch, Dual No Lead Package (UDFN)
5-lead, 2.90mm x 1.60mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Array Package (VFBGA)
(2)
(1)
(2)
(3)
(2)
(2)
(1)
(2)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
Package Type
Voltage
Package
Die Sale
8U3-1
5TS1
8P3
8S1
8S1
8A2
8A2
8Y6
Atmel AT24C02C
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(–40°C to 85°C)
(–40°C to 85°C)
15

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