AT24C04BN-SH-T Atmel, AT24C04BN-SH-T Datasheet - Page 25

IC EEPROM 4KBIT 1MHZ 8SOIC

AT24C04BN-SH-T

Manufacturer Part Number
AT24C04BN-SH-T
Description
IC EEPROM 4KBIT 1MHZ 8SOIC
Manufacturer
Atmel
Datasheet

Specifications of AT24C04BN-SH-T

Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
4K (512 x 8)
Speed
400kHz, 1MHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Organization
512 K x 8
Interface Type
2-Wire
Maximum Clock Frequency
1 MHz
Access Time
900 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Maximum Operating Current
3 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
2.5 V, 3.3 V, 5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT24C04BN-SH-T
Manufacturer:
ATMEL
Quantity:
40
Part Number:
AT24C04BN-SH-T
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
5226G–SEEPR–11/09
5TS1 – SOT23
Figure 19.
NOTES: 1. This d rawing is for gene ral information onl y. Re fer to JEDEC D rawing
R
2. Dimension D does not include mold flash, prot
3. The pa ckage top m ay be smaller than the pa ckage bottom . Dimensions
4. These dimensions apply to the flat section of the lead bet
5. Dimension "b" does not include Dambar prot rusion . Allowable Dambar
5TS1 – SOT23
1150 E . Cheyenne Mtn . Blvd.
Colorado Sp rings, CO 80906
MO-193, Variation A B, for additional in formation.
Mold flash, prot rusion s, or gate burrs shall not exceed 0.15 mm per end.
Dimension E1 does not include inte rlead flash or prot rusion . Inte rlead
flash or prot rusion shall not exceed 0.15 mm per sid e.
D and E1 are dete rmined at the oute rmost extremes of the plastic body
exclusi ve of mold flash, tie bar burrs, gate burrs, and inte rlead flash, but
including a ny mismatch bet ween the top and bottom of the plastic bod y.
and 0.15 mm from the lead ti p.
protrusion shall be 0.08 mm total in
maxi mum mate rial condition . The Dambar cannot be located on the l ower
radius of the foot. Mini mum space bet ween prot rusion and an adjacent lead
shall not be less than 0.07 mm.
Seating
Plane
E1
1
5
Top View
b
Side View
excess of the "b" dimension at
TITLE
5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
Small Outline Package (SHRINK SOT)
e1
D
2
e
rusion s, or gate burrs.
3
4
ween 0.08 mm
A2
E
A1
Two-wire Serial EEPROM
A
SYMBOL
A
A1
A2
c
D
E
E1
L1
e
e1
b
0.30
COMMON DIMENSIONS
0.00
0.70
0.08
MIN
(Unit of Measure = mm)
C
End View
2.90 BS C
2.80 BS C
1.60 BS C
0.60 REF
0.95 BSC
1.90 BSC
NOM
0.90
DRAWING NO.
C
PO5TS1
L
L1
1.10
0.10
1.00
0.20
MAX
0.50
NOTE
4, 5
2, 3
2, 3
2, 3
4
6/25/03
REV.
A
25

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