24LCS52-I/SN Microchip Technology, 24LCS52-I/SN Datasheet - Page 20

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24LCS52-I/SN

Manufacturer Part Number
24LCS52-I/SN
Description
IC EEPROM 2KBIT 400KHZ 8SOIC
Manufacturer
Microchip Technology
Datasheets

Specifications of 24LCS52-I/SN

Memory Size
2K (256 x 8)
Package / Case
8-SOIC (3.9mm Width)
Operating Temperature
-40°C ~ 85°C
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Speed
100kHz, 400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.2 V ~ 5.5 V
Organization
256 K x 8
Interface Type
I2C
Maximum Clock Frequency
0.4 MHz
Access Time
900 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.2 V
Maximum Operating Current
3 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
2.2 V, 5.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
24LCS52-I/SN
Manufacturer:
MCP
Quantity:
2 000
24AA52/24LCS52
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
DS21166J-page 20
JEDEC Equivalent MO-229 VCED-2
DWG No. C04-123
REF: Reference Dimension, usually without tolerance, for information purposes only.
§ Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad may vary according to die attach paddle size.
3. Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
* Controlling Parameter
** Not within JEDEC parameters
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Length §
Contact-to-Exposed Pad
Contact Width
See ASME Y14.5M
See ASME Y14.5M
ID INDEX
(NOTE 1)
A3
AREA
PIN 1
Dimension Limits
TOP VIEW
D
§
Units
D2
E2
A3
A1
n
D
E
L
K
b
e
A
E
MIN
A1
.000
.059
.012
.008
.008
.031
.051
CONFIGURATION
A
ALTERNATE
DETAIL
CONTACT
.008 REF.
.020 BSC
.079 BSC
.118 BSC
INCHES
NOM
EXPOSED
.035
.016
.010
.001
(NOTE 2)
METAL
8
EXPOSED
K
(NOTE 3)
PAD
TIE BAR
MAX
.039
.002
.069
.075
.020
.012
BOTTOM VIEW
b
MIN
1.30**
1.50**
D2
0.80
0.00
0.30
0.20
0.20
2
MILLIMETERS*
p
© 2005 Microchip Technology Inc.
0.20 REF.
1
0.50 BSC
2.00 BSC
3.00 BSC
Revised 09-12-05
n
NOM
0.90
0.02
0.40
0.25
E2
8
L
MAX
1.00
0.05
1.75
1.90
0.50
0.30

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