25C040-E/SN Microchip Technology, 25C040-E/SN Datasheet - Page 13
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
25C040-E/SN
Manufacturer Part Number
25C040-E/SN
Description
IC EEPROM 4KBIT 3MHZ 8SOIC
Manufacturer
Microchip Technology
Datasheet
1.25LC040SN.pdf
(22 pages)
Specifications of 25C040-E/SN
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
4K (512 x 8)
Speed
3MHz
Interface
SPI, 3-Wire Serial
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
© 2006 Microchip Technology Inc.
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
eB
E1
E
Dimension Limits
§
Units
2
1
eB
A2
E1
B1
A1
E
D
n
p
A
L
c
B
c
D
MIN
25AA040/25LC040/25C040
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
Note:
A
8
A1
.155
.130
.313
.250
.370
.100
.373
.130
.012
.058
.018
10
10
B1
B
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MIN
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
8
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
p
A2
MAX
10.92
L
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
4.32
DS21204E-page 13
15
15