SC-WII SolderCore, SC-WII Datasheet - Page 5

• Manufacturer Part Number: SC-WII
• Description: Daughter Cards & OEM Boards CoreWii SExI Mod Wii Attachment
• Manufacturer: SolderCore

Specifications of SC-WII

• Rohs: yes
• Product: Daughter Boards
• Interface Type: I2C
• Operating Supply Voltage: 3.3 V

Appendix A: SolderCore Expansion Interface
The SolderCore range of sensors use a standard interface named SExI (Sensor
Expansion Interface). This 16-pin standard allows a single development hardware
platform to be used to evaluate a range of sensors. SExI has been designed to make
prototyping sensors simpler; the standard makes use of two 0.1” headers on a 0.1”
grid for easy assembly on to bread or vero-board
SExI defines signals so that sensors that use I2C, SPI and simple UART can take
advantage of a common footprint. SExI provides connections for two power rails,
3.3V and 5.0V. Figure 2 shows a dimensioned drawing of a full SExI device.
For sensors/devices that only support either I2C or SPI, it is not necessary to use a full
16 pin footprint. For SPI only sensors, only the top four rows of pins are required. For
I2C based sensors, only the bottom four pins are required, in both instances the
sensor foot print can be halved, saving board space and lowering cost. Sensors that
utilize UART communications require a full 16 pin footprint.
The DIO signal (bottom left) can be used as a digital input or output. Many sensors
use interrupt signals, to inform the external electronics/processor that an even has
occurred. In most instances the interrupt line is taken to DIO pin.
The AN pin can be either a Digital IO or an Analog output pin. Sensors that output
analog signals use this pin. The SenseCore shield routes the ANx signals to the ADC
pins of the SolderCore / Arduino headers.
The right hand side of the PCB is marked with a thick white bar this identifies the
power side of the connector.
Figure 2. SExI device footprint.
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