IS62WV1288BLL-55TLI-TR ISSI, Integrated Silicon Solution Inc, IS62WV1288BLL-55TLI-TR Datasheet - Page 12

• Manufacturer Part Number: IS62WV1288BLL-55TLI-TR
• Description: IC SRAM 1MBIT 55NS 32TSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc

Specifications of IS62WV1288BLL-55TLI-TR

• Format - Memory: RAM
• Memory Type: SRAM - Asynchronous
• Memory Size: 1M (128K x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-TSOP
• Density: 1Mb
• Access Time (max): 55ns
• Sync/async: Asynchronous
• Architecture: Not Required
• Clock Freq (max): Not RequiredMHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 17b
• Package Type: TSOP-I
• Operating Temp Range: -40C to 85C
• Number Of Ports: 1
• Supply Current: 8mA
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 32
• Word Size: 8b
• Number Of Words: 128K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGING INFORMATION
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. C
06/13/03
450-mil Plastic SOP
Package Code: Q (32-pin)
S
No. Leads
Symbol
A1
E1
A
B
C
D
E
S
e
L
α
N
1
e
20.14
13.87
11.18
MILLIMETERS
Min.
0.10
0.36
0.15
0.58
—
0°
—
1.27 BSC
20.75
14.38
11.43
Max.
D
3.00
0.51
0.30
0.99
0.86
10°
—
32
0.004
0.014
0.006
0.793
0.546
0.440
0.023
Min.
B
—
—
0°
0.050 BSC
INCHES
E1
A
0.118
0.020
0.012
0.817
0.566
0.450
0.039
0.034
Max.
10°
—
A1
1-800-379-4774
E
SEATING PLANE
Notes:
1. Controlling dimension: inches, unless
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold
4. Formed leads shall be planar with respect to
L
otherwise specified.
flash protrusions and should be measured
from the bottom of the package.
one another within 0.004 inches at the
seating plane.
α
C