EVA2200-A Maestro Wireless Solutions, EVA2200-A Datasheet - Page 23

• Manufacturer Part Number: EVA2200-A
• Description: GPS Development Tools SiRFStar IV GPS Eval kit SMT ROM module
• Manufacturer: Maestro Wireless Solutions

Specifications of EVA2200-A

• Rohs: yes
• Product: Evaluation Kits
• Tool Is For Evaluation Of: A2200-A
• Frequency: 1.575 GHz
• Operating Supply Voltage: 3.3 V
• Interface Type: USB
• Description/function: GPS Evaluation Kit EVA2200-A allows an easy evaluation of Maestro's SiRFstarIV GPS receiver module A2200-A
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Current: 50 mA
• Processor Used: SiRFstar IV

V1.0 – Feb-12
7 Mounting
This chapter describes the suggested mounting process for the A2200-A receiver
module. In a RoHS compliant product with a RoHS compliant process it is recom-
mended to use chemical tin as the counter-part to the module’s pins. This will
guarantee highest resistance against shocks.
7.1 Proposed Footprint for Soldering
Following soldering footprint parameters are recommended:
7.2 Recommended Profile for Reflow Soldering
Typical values for reflow soldering of the module in convection or IR/convection
ovens are as follows (according to IPC/JEDEC J-STD-020D):
The solder pads hold solder of a thickness of about 150 µm for improved solder
process results.
As results of soldering may vary among different soldering systems and types of
solder and depend on additional factors like density and types of components on
board, the values above should be considered as a starting point for further optimi-
zation.
Parameter
Peak temperature (RoHS compliant process)
Average ramp up rate to peak (217°C to Peak)
Preheat temperature
Ramp up time from min. to max. preheat temperature
Temperature maintained above 217°C
Time within 5°C of actual peak temperature
Ramp down rate
Time 25°C to peak temperature
 Copper and solder paste footprint are identical
 Pad-shape / -size, inner pads: 1.2 mm x 1.2 mm
 Pad-shape / -size, outer pads: 1.0 mm x 0.8 mm
 Stencil thickness of 120 – 150 µm
Table 8: Reflow soldering profile A2200-A
User’s Manual
Value
245°C
3°C / second max.
min=150°C; max=200°C
60 … 120 seconds
60 … 150 seconds
30 seconds
6°C / second max.
8 minutes max.
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