ZICM357P2-2C CEL, ZICM357P2-2C Datasheet - Page 12

• Manufacturer Part Number: ZICM357P2-2C
• Description: Zigbee / 802.15.4 Modules MeshConnect Module 2405-2480MHz
• Manufacturer: CEL

Specifications of ZICM357P2-2C

• Rohs: yes
• Frequency Band: 2.405 GHz to 2.48 GHz
• Line Of Sight Range: 13000 ft
• Data Rate: 250 kbps
• Sensitivity: - 100 dBm
• Operating Supply Voltage: 3.3 V
• Supply Current Transmitting: 170 mA
• Supply Current Receiving: 28 mA
• Output Power: 20 dBm
• Antenna Connector Type: U.FL
• Maximum Operating Temperature: + 85 C
• Dimensions: 1.4 in x 1 in x 0.195 in
• Minimum Operating Temperature: - 40 C

PROCESSING
Recommended Reflow Profile
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note:
the appropriate IPC
Terminations Section.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be
easily removed with any cleaning process.
The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the module to the host board, consider optical inspection to check the following:
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Parameters Values
Ramp Up Rate (from Tsoakmax to Tpeak)
Minimum Soak Temperature
Maximum Soak Temperature
Soak Time
TLiquidus
Time above TL
Tpeak
Time within 5º of Tpeak
Time from 25º to Tpeak
Ramp Down Rate
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host
• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two
• Ultrasonic cleaning could damage the module permanently.
• Proper alignment and centering of the module over the pads
• Proper solder joints on all pads
• Excessive solder or contacts to neighboring pads or vias
board and the module. The combination of soldering flux residuals and encapsulated water could lead to
short circuits between neighboring pads. Water could also damage any stickers or labels.
housings, which is not accessible for post-washing inspection. The solvent could also damage any
stickers or labels.
The quality of solder joints on the castellations ("half vias") where they contact the host board should meet
Specification. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated
3º/sec max
150ºC
200ºC
60-120 sec
217ºC
60-150 sec
250ºC
20-30 sec
8 min max
6ºC/sec max
MeshConnect™ EM357 Module
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