MAX3202EEBS+T Maxim Integrated, MAX3202EEBS+T Datasheet - Page 2

• Manufacturer Part Number: MAX3202EEBS+T
• Description: TVS Diode Arrays
• Manufacturer: Maxim Integrated
• Series: MAX3202E, MAX3203E, MAX3204E, MAX3206Er

Specifications of MAX3202EEBS+T

• Channels: 2 Channels
• Clamping Voltage: 105.5 V
• Operating Voltage: 5.5 V
• Termination Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Maximum Operating Temperature: + 85 C
• Capacitance: 7 pF
• Dimensions: 1.05 mm W x 1.05 mm L x 0.33 mm H
• Package / Case: UCSP-4
• Peak Pulse Power Dissipation: 1951 mW

ABSOLUTE MAXIMUM RATINGS
V
I/O_ to GND ................................................-0.3V to (V
Continuous Power Dissipation (T
PACKAGE THERMAL CHARACTERISTICS (Note 1)
4 WLP
6 WLP
9 WLP
Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD
Protection Arrays for High-Speed Data Interfaces
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
Note 2: Limits over temperature are guaranteed by design, not production tested.
Note 3: Idealized clamp voltages (L1 = L2 = L3 = 0) (Figure 1 ); see the Applications Information section for more information.
Note 4: Guaranteed by design. Not production tested.
2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Supply Voltage
Supply Current
Diode Forward Voltage
Channel Clamp Voltage
(Note 3)
Channel Leakage Current
Channel Input Capacitance
ESD PROTECTION
Human Body Model
IEC 61000-4-2
Contact Discharge
IEC 61000-4-2
Air-Gap Discharge
CC
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Ambient Thermal Resistance (θ
2 × 2 WLP (derate 11.5mW/°C above +70°C)...............920mW
3 × 2 WLP (derate 12.3mW/°C above +70°C)...............984mW
3 × 3 WLP (derate 14.1mW/°C above +70°C).............1128mW
CC
_______________________________________________________________________________________
to GND ...........................................................-0.3V to +7.0V
= +5V ±5%, T
PARAMETER
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
A
= T
MIN
to T
SYMBOL
A
MAX
= +70°C)
V
I
V
V
CC
CC
C
, unless otherwise noted. Typical values are at V
F
JA
JA
JA
I
T
Human Body Model,
I
T
Contact Discharge
(IEC 61000-4-2), I
T
Air-Gap Discharge
(IEC 61000-4-2), I
T
V
F
F
A
A
A
A
CC
)...............87°C/W
)...............84°C/W
)...............71°C/W
= 10A
= 10mA
= +25°C, ±15kV
= +25°C, ±8kV
= +25°C, ±15kV
= 0°C to +50°C (Note 4)
= 5V, bias of V
CC
+ 0.3V)
F
F
CONDITIONS
= 24A
= 45A
CC
/2
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature .....................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
6 TDFN
12 TQFN
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
6-Pin TDFN (derate 24.4mW/°C above +70°C) ..........1951mW
12-Pin TQFN (derate 16.9mW/°C above +70°C) ........1349mW
Positive transients
Negative transients
Positive transients
Negative transients
Positive transients
Negative transients
CC
= +5V and T
0.65
MIN
0.9
-1
A
= +25°C.) (Note 2)
TYP
±15
±15
1
5
±8
JC
JC
)...........................9°C/W
)...........................6°C/W
JA
JA
V
)....................42°C/W
)....................41°C/W
V
V
CC
CC
CC
MAX
0.95
-100
100
5.5
-25
-60
+1
+ 100
7
+ 25
+ 60
UNITS
nA
nA
pF
kV
kV
kV
V
V
V