BTA312-600D/DG,127 NXP Semiconductors, BTA312-600D/DG,127 Datasheet - Page 11

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BTA312-600D/DG,127

Manufacturer Part Number
BTA312-600D/DG,127
Description
Triacs 3Q HI-COM TRIAC
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BTA312-600D/DG,127

Rohs
yes
Mounting Style
Through Hole
Package / Case
TO-220AB-3
Factory Pack Quantity
50
NXP Semiconductors
9. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
8.2
8.3
8.4
© NXP B.V. 2012. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 4 October 2012
BTA312-600D
Product data sheet
Product profile ....................................................... 1
Pinning information ............................................... 2
Ordering information ............................................. 2
Limiting values .......................................................2
Thermal characteristics .........................................4
Characteristics ....................................................... 5
Package outline ..................................................... 8
Legal information ...................................................9
General description .............................................. 1
Features and benefits ...........................................1
Applications .......................................................... 1
Quick reference data ............................................ 1
Data sheet status ................................................. 9
Definitions .............................................................9
Disclaimers ...........................................................9
Trademarks ........................................................ 10
All information provided in this document is subject to legal disclaimers.
4 October 2012
BTA312-600D
© NXP B.V. 2012. All rights reserved
3Q Hi-Com Triac
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