BTA316X-800B0,127 NXP Semiconductors, BTA316X-800B0,127 Datasheet - Page 10

• Manufacturer Part Number: BTA316X-800B0,127
• Description: Triacs 3Q HI-COM TRIAC
• Manufacturer: NXP Semiconductors

Specifications of BTA316X-800B0,127

• Rohs: yes
• Mounting Style: Through Hole
• Package / Case: TO-220F-3
• Factory Pack Quantity: 50

NXP Semiconductors
8. Package outline
Fig 12. Package outline SOT186A (TO-220F)
BTA316X-800B0
Product data sheet
Plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 3-lead TO-220 'full pack'
Notes
1. Terminal dimensions within this zone are uncontrolled.
2. Both recesses are
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT186A
4.6
4.0
A
2.9
2.5
A 1
0.9
0.7
b
2.5
1.1
0.9
0.8 max. depth
b 1
IEC
D
L
D 1
L 2
1.4
1.0
b 2
b 1
b 2
0.7
0.4
c
1
3-lead TO-220F
15.8
15.2
All information provided in this document is subject to legal disclaimers.
e
JEDEC
2
D
e 1
E
P
b
3
6.5
6.3
D 1
REFERENCES
Rev. 2 — 17 November 2011
10.3
9.7
E
0
w
L 1
T
2.54
M
e
JEITA
scale
q
5
5.08
e 1
10 mm
2.7
1.7
j
0.6
0.4
K
mounting
base
14.4
13.5
L
j
K
3.30
2.79
L 1
BTA316X-800B0
A 1
Q
A
max.
L 2
PROJECTION
EUROPEAN
3
(1)
c
3.2
3.0
P
2.6
2.3
Q
© NXP B.V. 2011. All rights reserved.
3Q Hi-Com Triac
3.0
2.6
q
ISSUE DATE
02-04-09
06-02-14
T
2.5
(2)
SOT186A
0.4
w
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