ZSPM4551KIT V1.0 ZMDI, ZSPM4551KIT V1.0 Datasheet - Page 28

• Manufacturer Part Number: ZSPM4551KIT V1.0
• Description: Power Management IC Development Tools Li/Ion converter Kit
• Manufacturer: ZMDI
• Type: Battery Managementr

Specifications of ZSPM4551KIT V1.0

• Product Category: Power Management IC Development Tools
• Rohs: yes
• Product: Evaluation Kits
• Tool Is For Evaluation Of: ZSPM4551
• Input Voltage: 3.5 V to 7.2 V
• Output Voltage: 3.94 V to 4.18 V
• Interface Type: I2C
• Output Current: 1.5 A

Figure 5.3 is a representation of how the heat can be conducted away from the die using an exposed pad
package. Each application will have different requirements and limitations, and therefore the user should use
sufficient copper to dissipate the power in the system. The output current rating for the linear regulators might
need to be de-rated for ambient temperatures above 85°C. The de-rated value will depend on calculated worst
case power dissipation and the thermal management implementation in the application.
Figure 5.3
5.2.
Layout recommendations for a single-layer PCB: Utilize as much copper area for power management as possible.
In a single-layer board application, the thermal pad is attached to a heat spreader (copper areas) by using a low
thermal impedance attachment method (solder paste or thermal conductive epoxy).
In both of the methods mentioned above, it is advisable to use as much copper trace as possible to dissipate the
heat.
Data Sheet
December 4, 2012
ZSPM4551
High-Efficiency Charger for Li-Ion Batteries
Single-Layer PCB Layout
Conducting Heat Away from the Die using an Exposed Pad Package
Note: NOT to scale.
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.00
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the
prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
Ground Layer, 1oz Cu
Bottom Layer, 2oz Cu
Single Layer, 2oz Cu
Signal Layer, 1oz Cu
Mold compound
Die
Epoxy Die attach
Exposed pad
Solder
5% - 10% Cu coverage
Thermal Vias with Cu plating
90% Cu coverage
20% Cu coverage
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