MAX1788EVKIT# Maxim Integrated, MAX1788EVKIT# Datasheet - Page 4

• Manufacturer Part Number: MAX1788EVKIT#
• Description: Power Management IC Development Tools Evaluation Kit for MAX1788
• Manufacturer: Maxim Integrated

V. Quality Assurance Information
VI. Reliability Evaluation
A. Quality Assurance Contacts:
B. Outgoing Inspection Level:
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
A. Accelerated Life Test
Rate (λ) is calculated as follows:
λ =
performs quarterly 1000 hour life test monitors on its processes.
Reliability Report found at http://www.maxim-ic.com/. Current monitor data for the S4E Process results in a FIT
Rate of 0.9 @ 25C and 13.84 @ 55C (0.8 eV, 60% UCL)
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
HBM per JEDEC JESD22-A114-D. Latch-Up testing has shown that this device withstands a current of ±100mA.
MTTF
1
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
λ = 22.4 x 10
λ = 22.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
The UC10 die type has been found to have all pins able to withstand a transient ESD pulse of 1000 V
=
135 x 4340 x 48 x 2
-9
1.83
Temperature Acceleration factor assuming an activation energy of 0.8eV
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
(Chi square value for MTTF upper limit)
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director)
This data is published in the Product