M25PE80-VMP6TG NUMONYX, M25PE80-VMP6TG Datasheet - Page 53

IC FLASH 8MBIT 75MHZ 8VFQFPN

M25PE80-VMP6TG

Manufacturer Part Number
M25PE80-VMP6TG
Description
IC FLASH 8MBIT 75MHZ 8VFQFPN
Manufacturer
NUMONYX
Series
Forté™r
Datasheet

Specifications of M25PE80-VMP6TG

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
8M (1M x 8)
Speed
75MHz
Interface
SPI, 3-Wire Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-VFQFN, 8-VFQFPN
Cell Type
NOR
Density
8Mb
Access Time (max)
8ns
Interface Type
Serial (SPI)
Boot Type
Not Required
Address Bus
1b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
VFQFPN
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Synchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
1M
Supply Current
8mA
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
M25PE80-VMP6TG
M25PE80-VMP6TGTR

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M25PE80
Table 23.
1.
2. t
3. Value guaranteed by characterization, not 100% tested in production.
4. Only applicable as a constraint for a WRSR instruction when SRWD is set to ‘1’.
5. When using PP and PW instructions to update consecutive bytes, optimized timings are obtained with one sequence
6.
Symbol
t
t
t
WHSL
SHWL
SHQZ
t
t
t
t
t
t
t
t
t
t
t
t
t
RDP
t
t
DVCH
CHDX
CHSH
SHCH
CLQV
CLQX
PW
CH
SLCH
CHSL
SHSL
DP
t
CL
PP
See: Important note on page
including all the bytes versus several sequences of only a few bytes (1 ≤ n ≤ 256).
t
t
SSE
t
CH
int(A) corresponds to the upper integer part of A. For instance, int(12/8) = 2, int(32/8) = 4 int(15.3) =16.
t
f
f
PE
SE
BE
W
C
R
(2)
(2)
(3)
(4)
(5)
(3)
+ t
(3)
(4)
(4)
CL
must be greater than or equal to 1/ f
t
t
t
t
t
Alt.
t
t
CSS
DSU
t
CSH
CLH
CLL
DIS
HO
f
DH
t
C
AC characteristics (50 MHz operation,
V
Clock frequency for the following instructions:
FAST_READ, RDLR, PW, PP, WRLR, PE, SE,
SSE, DP, RDP, WREN, WRDI, RDSR, WRSR
Clock frequency for read instructions
Clock high time
Clock low time
Clock slew rate
S active setup time (relative to C)
S not active hold time (relative to C)
Data in setup time
Data in hold time
S active hold time (relative to C)
S not active setup time (relative to C)
S deselect time
Output disable time
Clock low to output valid
Output hold time
Write protect setup time
Write protect hold time
S to deep power-down
S high to standby mode
Write status register cycle time
Page write cycle time (256 bytes)
Page program cycle time (256 bytes)
Page program cycle time (n bytes)
Page erase cycle time
Sector erase cycle time
Subsector erase cycle time
Bulk erase cycle time
6.
Test conditions specified in
(2)
Parameter
(peak to peak)
C
.
T9HX (0.11µm) process
Table 17
D.C.
D.C.
Min
100
100
0.1
50
9
9
5
5
2
5
5
5
0
and
Table 18
int(n/8) × 0.025
(1)
Typ
0.8
11
10
50
10
3
1
)
DC and AC parameters
(6)
Max
150
50
33
30
15
23
20
20
8
8
3
3
5
MHz
MHz
V/ns
Unit
53/66
ms
ms
ms
ms
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
µs
s
s

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