AT24C512-10PI-2.7 Atmel, AT24C512-10PI-2.7 Datasheet

IC EEPROM 512KBIT 1MHZ 8DIP

AT24C512-10PI-2.7

Manufacturer Part Number
AT24C512-10PI-2.7
Description
IC EEPROM 512KBIT 1MHZ 8DIP
Manufacturer
Atmel
Datasheet

Specifications of AT24C512-10PI-2.7

Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
512K (64K x 8)
Speed
400kHz, 1MHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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Features
Description
The AT24C512 provides 524,288 bits of serial electrically erasable and programmable
read only memory (EEPROM) organized as 65,536 words of 8 bits each. The device’s
cascadable feature allows up to four devices to share a common two-wire bus. The
device is optimized for use in many industrial and commercial applications where low-
power and low-voltage operation are essential. The devices are available in space-
saving 8-pin PDIP, 8-lead EIAJ SOIC, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-lead
Leadless Array (LAP), and 8-lead SAP packages. In addition, the entire family is avail-
able in 2.7V (2.7V to 5.5V) and 1.8V (1.8V to 3.6V) versions.
Table 1. Pin Configurations
Pin Name
A0–A1
SDA
SCL
WP
NC
Low-voltage and Standard-voltage Operation
Internally Organized 65,536 x 8
Two-wire Serial Interface
Schmitt Triggers, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
1 MHz (5V), 400 kHz (2.7V) and 100 kHz (1.8V) Compatibility
Write Protect Pin for Hardware and Software Data Protection
128-byte Page Write Mode (Partial Page Writes Allowed)
Self-timed Write Cycle (5 ms Max)
High Reliability
Automotive Devices Available
8-lead PDIP, 8-lead EIAJ SOIC, 8-lead JEDEC SOIC, 8-lead TSSOP,
8-lead LAP, 8-lead SAP and 8-ball dBGA2 Packages
Die Sales: Wafer Form, Waffle Pack and Bumped Die
– 2.7 (V
– 1.8 (V
– Endurance: 100,000 Write Cycles
– Data Retention: 40 Years
VCC
SDA
SCL
CC
CC
WP
8-ball dBGA2
Bottom View
Function
Address Inputs
Serial Data
Serial Clock Input
Write Protect
No Connect
= 2.7V to 5.5V)
= 1.8V to 3.6V)
8
7
6
5
1
2
3
4
A0
A1
NC
GND
GND
8-lead Leadless Array
NC
VCC
SDA
A0
A1
SCL
WP
8-lead TSSOP
Bottom View
8
7
6
5
1
2
3
4
GND
NC
8
7
6
5
A0
A1
1
2
3
4
A0
A1
NC
GND
VCC
WP
SCL
SDA
8-lead SOIC
1
2
3
4
GND
8
7
6
5
VCC
SDA
SCL
NC
WP
A0
A1
Bottom View
8-lead PDIP
VCC
WP
SCL
SDA
8-lead SAP
8
7
6
5
1
2
3
4
8
7
6
5
1
2
3
4
A0
A1
NC
GND
VCC
WP
SCL
SDA
Two-wire Serial
EEPROM
512K (65,536 x 8)
AT24C512
Note: Not recommended for new
design; please refer to
AT24C512B datasheet.
Rev. 1116O–SEEPR–1/07
1

Related parts for AT24C512-10PI-2.7

AT24C512-10PI-2.7 Summary of contents

Page 1

... Die Sales: Wafer Form, Waffle Pack and Bumped Die Description The AT24C512 provides 524,288 bits of serial electrically erasable and programmable read only memory (EEPROM) organized as 65,536 words of 8 bits each. The device’s cascadable feature allows up to four devices to share a common two-wire bus. The device is optimized for use in many industrial and commercial applications where low- power and low-voltage operation are essential ...

Page 2

... Voltage on Any Pin with Respect to Ground .................................... –1.0V to +7.0V Maximum Operating Voltage .......................................... 6.25V DC Output Current........................................................ 5.0 mA Figure 1. Block Diagram AT24C512 2 *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent dam- age to the device. This is a stress rating only and ...

Page 3

... GND if the capacitive coupling to the circuit board V >3 pF, Atmel recommends connecting the pin to GND. Switching write operation creates a software write protect function. AT24C512, 512K SERIAL EEPROM: The 512K is internally organized as 512 pages of 128-bytes each. Random word addressing requires a 16-bit data word address. plane is <3 pF. If coupling is ...

Page 4

... V Input High Level IH V Output Low Level OL2 V Output Low Level OL1 Note min and V max are reference only and are not tested AT24C512 4 = 25° 1.0 MHz SCL 40°C to +85°C, V – AI Test Condition V = 5.0V READ at 400 kHz 5.0V ...

Page 5

... Input rise and fall times: ≤50 ns Input and output timing reference voltages: 0.5V 3. The Write Cycle Time only applies to the AT24C512 devices bearing the process letter “A” on the package (the mark is located in the lower right corner on the top side of the package). ...

Page 6

... EEPROM in 8-bit words. The EEPROM sends a zero during the ninth clock cycle to acknowledge that it has received each word. STANDBY MODE: The AT24C512 features a low power standby mode which is enabled: a) upon power-up and b) after the receipt of the STOP bit and the completion of any internal operations ...

Page 7

Figure 2. Bus Timing (SCL: Serial Clock, SDA: Serial Data I/O) Figure 3. Write Cycle Timing (SCL: Serial Clock, SDA: Serial Data I/O) SCL SDA 8th BIT WORDn Note: 1. The write cycle time t is the time from a ...

Page 8

... Figure 5. Start and Stop Definition Figure 6. Output Acknowledge AT24C512 8 1116O–SEEPR–1/07 ...

Page 9

... Upon a compare of the device address, the EEPROM will output a “0” compare is not made, the device will return to a standby state. DATA SECURITY: The AT24C512 has a hardware data protection scheme that allows the user to Write Protect the whole memory when the WP pin BYTE WRITE: A write operation requires two 8-bit data word addresses following the device address word and acknowledgment ...

Page 10

... Read Operations AT24C512 10 Read operations are initiated the same way as write operations with the exception that the Read/Write select bit in the device address word is set to “1”. There are three read operations: current address read, random address read and sequential read. ...

Page 11

Figure 8. Byte Write Figure 9. Page Write Figure 10. Current Address Read Figure 11. Random Read 1116O–SEEPR–1/07 11 ...

Page 12

... Figure 12. Sequential Read AT24C512 12 1116O–SEEPR–1/07 ...

Page 13

... AT24C512W-10SU-2.7 (2) AT24C512W-10SU-1.8 (2) AT24C512N-10SU-2.7 (2) AT24C512N-10SU-1.8 (2) AT24C512-10TU-2.7 (2) AT24C512-10TU-1.8 (2) AT24C512Y4-10YU-1.8 (2) AT24C512U4-10UU-1.8 (3) AT24C512-W1.8-11 Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics tables. 2. “U” designates Green package + RoHS compliant. 3. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please contact Serial EEPROM marketing ...

Page 14

... Packaging Information 8U4-1 — dBGA2 A1 BALL PAD CORNER e (e1) BOTTOM VIEW 5. Dimension 'b' is measured at the maximum solder ball diameter. This drawing is for general information only. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R AT24C512 TOP VIEW A1 BALL PAD CORNER (d1) 8 SOLDER BALLS TITLE 8U4-1, 8-ball, 2 ...

Page 15

LAP Marked Pin1 Indentifier E 0.10 mm TYP Bottom View Note: 1. Metal Pad Dimensions. 2. All exposed metal area shall have the following finished platings. Ni: 0.0005 to 0.015 mm Au: ...

Page 16

... D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 2325 Orchard Parkway San Jose, CA 95131 R AT24C512 ...

Page 17

EIAJ SOIC 1 N Top View e D Side View Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information. 2. Mismatch of the upper and lower dies and resin burrs ...

Page 18

... JEDEC SOIC Top View e Side View Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R AT24C512 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing ...

Page 19

TSSOP Pin 1 indicator this corner N Top View Side View Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, ...

Page 20

... SAP PIN 1 INDEX AREA D E 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80817 R AT24C512 20 A PIN COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN A – A1 0.00 D 5.80 E 4.70 D1 2.85 E1 2. 0.50 TITLE 8Y4, 8-lead (6.00 x 4.90 mm Body) SOIC Array Package (SAP) Y4 ...

Page 21

Revision History 1116O–SEEPR–1/07 Doc. Rev. Date Comments 1116O 1/2007 Revision history implemented. Added Note to Page 1 recommending new device. 21 ...

Page 22

... Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI- TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT ...

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