AT45DB081D-SU Atmel, AT45DB081D-SU Datasheet

IC FLASH 8MBIT 66MHZ 8SOIC

AT45DB081D-SU

Manufacturer Part Number
AT45DB081D-SU
Description
IC FLASH 8MBIT 66MHZ 8SOIC
Manufacturer
Atmel
Datasheets

Specifications of AT45DB081D-SU

Format - Memory
FLASH
Memory Type
DataFLASH
Memory Size
8M (4096 pages x 264 bytes)
Speed
66MHz
Interface
SPI, RapidS
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Architecture
Sectored
Interface Type
SPI
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Maximum Operating Current
15 mA
Mounting Style
SMD/SMT
Organization
64 KB x 16
Memory Configuration
4096 Pages X 264 Bytes
Clock Frequency
50MHz
Supply Voltage Range
2.5V To 3.6V, 2.7V To 3.6V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Features
1. Description
The AT45DB081D is a 2.5V or 2.7V, serial-interface Flash memory ideally suited for a
wide variety of digital voice-, image-, program code- and data-storage applications.
The AT45DB081D supports RapidS serial interface for applications requiring very
high speed operations. RapidS serial interface is SPI compatible for frequencies up to
66 MHz. Its 8,650,752 bits of memory are organized as 4,096 pages of 256 bytes or
264 bytes each. In addition to the main memory, the AT45DB081D also contains two
SRAM buffers of 256/264 bytes each. The buffers allow the receiving of data while a
page in the main Memory is being reprogrammed, as well as writing a continuous
data stream. EEPROM emulation (bit or byte alterability) is easily handled with a self-
contained three step read-modify-write operation. Unlike conventional Flash memo-
ries that are accessed randomly with multiple address lines and a parallel interface,
Single 2.5V or 2.7V to 3.6V Supply
RapidS
User Configurable Page Size
Page Program Operation
Flexible Erase Options
Two SRAM Data Buffers (256/264 Bytes)
Continuous Read Capability through Entire Array
Low-power Dissipation
Hardware and Software Data Protection Features
Sector Lockdown for Secure Code and Data Storage
Security: 128-byte Security Register
JEDEC Standard Manufacturer and Device ID Read
100,000 Program/Erase Cycles Per Page Minimum
Data Retention – 20 Years
Industrial Temperature Range
Green (Pb/Halide-free/RoHS Compliant) Packaging Options
– SPI Compatible Modes 0 and 3
– 256 Bytes per Page
– 264 Bytes per Page
– Intelligent Programming Operation
– 4,096 Pages (256/264 Bytes/Page) Main Memory
– Page Erase (256 Bytes)
– Block Erase (2 Kbytes)
– Sector Erase (64 Kbytes)
– Chip Erase (8 Mbits)
– Allows Receiving of Data while Reprogramming the Flash Array
– Ideal for Code Shadowing Applications
– 7 mA Active Read Current Typical
– 25 µA Standby Current Typical
– 5 µA Deep Power Down Typical
– Individual Sector
– Individual Sector
– 64-byte User Programmable Space
– Unique 64-byte Device Identifier
®
Serial Interface: 66 MHz Maximum Clock Frequency
8-megabit
2.5-volt or
2.7-volt
DataFlash
AT45DB081D
3596F–DFLASH–8/07
®

Related parts for AT45DB081D-SU

AT45DB081D-SU Summary of contents

Page 1

... Green (Pb/Halide-free/RoHS Compliant) Packaging Options 1. Description The AT45DB081D is a 2.5V or 2.7V, serial-interface Flash memory ideally suited for a wide variety of digital voice-, image-, program code- and data-storage applications. The AT45DB081D supports RapidS serial interface for applications requiring very high speed operations. RapidS serial interface is SPI compatible for frequencies MHz ...

Page 2

... To allow for simple in-system reprogrammability, the AT45DB081D does not require high input voltages for programming. The device operates from a single power supply, 2.5V to 3.6V or 2.7V to 3.6V, for both the program and read operations. The AT45DB081D is enabled through the chip select pin (CS) and accessed via a three-wire interface consisting of the Serial Input (SI), Serial Output (SO), and the Serial Clock (SCK) ...

Page 3

... Ground: The ground reference for the power supply. GND should be connected to the system GND ground. 3596F–DFLASH–8/07 pin is used to supply the source voltage to the device. CC voltages may produce spurious results and should not be attempted. CC AT45DB081D Asserted State Type Low Input – Input – ...

Page 4

... GND 4. Memory Array To provide optimal flexibility, the memory array of the AT45DB081D is divided into three levels of granularity comprising of sectors, blocks, and pages. The “Memory Architecture Diagram” illustrates the breakdown of each level and details the number of pages per sector and block. All program operations to the DataFlash occur on a page by page basis. The erase operations can be performed at the chip, sector, block or page level ...

Page 5

... The CS pin must remain low during the loading of the opcode, the address bytes, the don’t care bytes, and the reading of data. When the end of a page in main memory is reached during a 3596F–DFLASH–8/07 AT45DB081D Table 15-1 on page 28 through Table 15-7 on ...

Page 6

... When the end of a page in the main memory is reached during a Continuous Array Read, the device will continue reading at the beginning of the next page with no delays incurred AT45DB081D 6 specification. The Continuous Array Read bypasses both data buffers and leaves the specification ...

Page 7

... When the end of a buffer is reached, the device will continue reading back at the beginning of the buffer. A low-to-high transition on the CS pin will terminate the read operation and tri-state the output pin (SO). 3596F–DFLASH–8/07 . The D1H and D3H opcode can be used for lower frequency CAR1 . CAR2 AT45DB081D 7 ...

Page 8

... It is necessary that the page in main memory that is being programmed has been previously erased using one of the erase commands (Page Erase or Block Erase). The programming of the page is internally self-timed and should take place in a maximum time of t status register will indicate that the part is busy. AT45DB081D 8 . During this time, EP ...

Page 9

... During this time, the status register will indicate that the part is busy. PE PA7/ PA6/ PA5/ PA4/ A15 A14 A13 A12 • • • • • • • • • • • • AT45DB081D PA3/ PA2/ PA1/ PA0/ A11 A10 • • • • • • • • • • • • During ...

Page 10

... The erase operation is internally self-timed and should take place in a time of t The Chip Erase command will not affect sectors that are protected or locked down; the contents of those sectors will remain unchanged. Only those sectors that are not protected or locked down will be erased. AT45DB081D 10 PA7/ PA6/ PA5/ ...

Page 11

... Status Register. 3596F–DFLASH–8/07 Chip Erase CS Opcode SI Byte 1 Each transition represents 8 bits Refer to errata regarding Chip Erase on AT45DB081D Byte 1 Byte 2 Byte 3 C7H 94H 80H Opcode Opcode Opcode Byte 2 ...

Page 12

... Disable Sector Protection commands. If the device is power cycled, then the software controlled protection will be disabled. Once the device is powered up, the Enable Sector Protection command should be reissued if sector pro- tection is desired and if the WP pin is not used. AT45DB081D 12 Byte 1 3DH Enable Sector Protection ...

Page 13

... When the WP pin is deasserted; however, the sector protection WPE 2 Disable Sector Command Protection Command – Issue Command Issue Command X Not Issued Yet or 2 Issue Command – Issue Command AT45DB081D , then the content of the Sector CC time) as long as the Enable Sec- WPD 3 Sector Protection Status X Disabled Disabled – Enabled X Enabled ...

Page 14

... Sector Protection Register.: Table 9-2. Sector Number Protected Unprotected Table 9-3. Sectors 0a, 0b Unprotected Protect Sector 0a Protect Sector 0b (Page 8-255) Protect Sectors 0a (Page 0-7), 0b (Page 8-255) Note: AT45DB081D 14 Sector Protection Register Sector 0 (0a, 0b) 0a (Page 0-7) Bit (1) 1. The default value for bytes 0 through 15 when shipped from Atmel x = don’ ...

Page 15

... Command Erase Sector Protection Register Figure 9-2. 3596F–DFLASH–8/07 Byte 1 3DH Erase Sector Protection Register CS Opcode Opcode SI Byte 1 Byte 2 Each transition represents 8 bits AT45DB081D PE Byte 2 Byte 3 Byte 4 2AH 7FH Opcode Opcode Byte 3 Byte 4 , during CFH 15 ...

Page 16

... Command Program Sector Protection Register Figure 9-3. Program Sector Protection Register CS Opcode SI Byte 1 Each transition represents 8 bits AT45DB081D 16 , during which time the Status Register will indicate that the device is busy Opcode Opcode Opcode Data Byte Byte 2 Byte 3 Byte 4 Section 9 ...

Page 17

... Instead, a combination of temporarily unprotecting individual sectors along with dis- abling sector protection completely will need to be implemented by the application to ensure that the limit of 10,000 cycles is not exceeded. 3596F–DFLASH–8/ Dummy Byte AT45DB081D Byte 1 Byte 2 Byte 3 32H xxH xxH Data Byte ...

Page 18

... Sector Lockdown Register to determine the status of the appropriate sector lockdown bits or bytes and reissue the Sector Lockdown com- mand if necessary. Command Sector Lockdown Figure 10-1. Sector Lockdown CS Opcode SI Byte 1 Each transition represents 8 bits AT45DB081D 18 Byte 1 3DH Opcode Opcode Opcode Address Byte 2 Byte 3 Byte 4 Bytes ...

Page 19

... CS SI Opcode SO Each transition represents 8 bits 3596F–DFLASH–8/07 Sector 0 (0a, 0b) (Page 0-7) Bit 7, 6 details the values read from the Sector Lockdown Register. Sector Lockdown Register xx = Dummy Byte Data Byte AT45DB081D 0 (0a, 0b) See Below 0a 0b (Page 8-255) Bit 5, 4 Bit ...

Page 20

... Therefore, the contents of the buffer 1 will be altered from its previous state when this command is issued. Figure 10-3. Program Security Register CS Opcode SI Byte 1 Each transition represents 8 bits AT45DB081D 20 Security Register • • • One-time User Programmable , during which time the Status Register will indicate that the device is busy. If the device P ...

Page 21

... SO pins. Deasserting the CS pin will terminate the Read Security Register operation and put the SO pin into a high-impedance state. Figure 10-4. Read Security Register CS SI Opcode SO Each transition represents 8 bits 3596F–DFLASH–8/ Data Byte n AT45DB081D Data Byte Data Byte ...

Page 22

... The operation is internally self-timed and should take place in a maximum time of t During this time, the status register will indicate that the part is busy. AT45DB081D 22 ), the status register can be read to determine whether the XFR ), the status register will indicate that the part is busy ...

Page 23

... The device density is indicated using bits and 2 of the status register. For the AT45DB081D, the four bits are 1001 The decimal value of these four binary bits does not equate to the device density; the four bits represent a combinational code relating to differing densities of DataFlash devices ...

Page 24

... RDPD down, the device will return to the normal standby mode. Command Resume from Deep Power-down Figure 12-2. Resume from Deep Power-Down AT45DB081D 24 time. Once the device has entered the Deep Power-down mode, all instructions EDPD CS SI Each transition represents 8 bits time before the device can receive any commands ...

Page 25

... Extended Device Information. 3596F–DFLASH–8/07 Section , during which time the Status Register will indicate that the device Opcode Opcode SI Byte 1 Byte 2 Each transition represents 8 bits AT45DB081D 13.1). Byte 1 Byte 2 Byte 3 3DH 2AH 80H Opcode Opcode Byte 3 Byte 4 Byte 4 ...

Page 26

... Manufacturer ID codes that are two, three or even four bytes long with the first byte(s) in the sequence being 7FH. A system should detect code 7FH as a “Continuation Code” and continue to read Manufacturer ID bytes. The first non-7FH byte would signify the last byte of Manufacturer ID data. For Atmel (and some other manufacturers), the Manufacturer ID data is comprised of only one byte. AT45DB081D 26 Bit 3 ...

Page 27

... Group C can be executed. The Group B commands using buffer 1 should use Group C commands using buffer 2 and vice versa. Finally, during the internally self- timed portion of a Group D command, only the Status Register Read command should be executed. 3596F–DFLASH–8/07 AT45DB081D 27 ...

Page 28

... Buffer 1 to Main Memory Page Program without Built-in Erase Buffer 2 to Main Memory Page Program without Built-in Erase Page Erase Block Erase Sector Erase Chip Erase Main Memory Page Program Through Buffer 1 Main Memory Page Program Through Buffer 2 AT45DB081D 28 Read Commands Program and Erase Commands Opcode D2H E8H 03H ...

Page 29

... Note: 3596F–DFLASH–8/07 Protection and Security Commands Additional Commands (1) Legacy Commands 1. These legacy commands are not recommended for new designs. AT45DB081D Opcode 3DH + 2AH + 7FH + A9H 3DH + 2AH + 7FH + 9AH 3DH + 2AH + 7FH + CFH 3DH + 2AH + 7FH + FCH 32H 3DH + 2AH + 7FH + 30H ...

Page 30

... B9h ABh D1h D2h D3h D4h D6h D7h E8h Notes Don’t Care AT45DB081D 30 Address Byte Address Byte N/A N/A N/A N/A N/A N N/A N ...

Page 31

... Address Byte N/A N/A N/A N/A N/A N N/A N Don’t Care AT45DB081D Address Byte N/A N Additional Don’t Care Bytes B N N/A x N/A x N/A x N/A x N/A x N/A x N/A x N/A x N/A x N/A B N/A x N/A B N/A B N/A x N/A B N/A x N/A x N/A ...

Page 32

... The regulator needs to supply this peak current requirement. An under specified regulator can cause current starvation. Besides increasing system noise, current starvation during program- ming or erase can lead to improper operation and possible data corruption. AT45DB081D 32 . During power-up, the internal Power-on Reset circuitry keeps the device in ...

Page 33

... OH Notes during a buffer read maximum @ 20 MHz. CC1 2. All inputs are 5 volts tolerant. 3596F–DFLASH–8/07 *NOTICE: + 0.6V CC AT45DB081D (2.5V Version) Ind. -40° 85° C 2. the minimum specified datasheet value, the system should wait 10 ms before an opera- CC Condition CS, RESET all IH inputs at CMOS levels ...

Page 34

... Page Erase Time (256/264 bytes Block Erase Time (2,048/2,112 bytes Sector Erase Time (65,536/67,584 Chip Erase Time CE t RESET Pulse Width RST t RESET Recovery Time REC AT45DB081D 34 AT45DB081D (2.5V Version) AT45DB081D Min Typ Max Min 6.8 6.8 6.8 6.8 0.1 0.1 0.1 0 ...

Page 35

... MHz) of the RapidS serial case. 3596F–DFLASH–8/07 2.4V AC DRIVING 1.5V LEVELS 0.45V DEVICE UNDER TEST 30 pF period. These timing waveforms are valid over the full frequency range (max- WL AT45DB081D AC MEASUREMENT LEVEL page 36. Waveform 1 shows the SCK signal being ). Timing waveforms 1 and 2 conform ...

Page 36

... Waveform 1 – SPI Mode 0 Compatible (for Frequencies MHz) CS SCK HIGH IMPEDANCE SO SI 21.2 Waveform 2 – SPI Mode 3 Compatible (for Frequencies MHz) CS SCK HIGH 21.3 Waveform 3 – RapidS Mode SCK HIGH IMPEDANCE SO SI 21.4 Waveform 4 – RapidS Mode SCK HIGH AT45DB081D CSS VALID OUT VALID CSS ...

Page 37

... Last bit of BYTE-MOSI is clocked out from the Master. E. Last bit of BYTE-MOSI is clocked into the slave. F. Slave clocks out first bit of BYTE-SO. G. Master clocks in first bit of BYTE-SO. H. Slave clocks out second bit of BYTE-SO. I. Master clocks in last bit of BYTE-SO. 3596F–DFLASH–8/ LSB BYTE-MOSI F AT45DB081D MSB BYTE- LSB 37 ...

Page 38

... Command Sequence for Read/Write Operations for Page Size 256 Bytes (Except Status Register Read, Manufacturer and Device ID Read) SI (INPUT) MSB 21.8 Command Sequence for Read/Write Operations for Page Size 264 Bytes (Except Status Register Read, Manufacturer and Device ID Read) SI (INPUT) MSB AT45DB081D 38 CMD 8 bits 8 bits Don’t Care Page Address ...

Page 39

... BINARY PAGE SIZE 16 DON'T CARE + BFA7-BFA0 X BFA7-0 X···X, BFA8 Starts self-timed erase/program operation BINARY PAGE SIZE A19- DON'T CARE BITS CMD PA10-7 AT45DB081D BUFFER 2 TO MAIN MEMORY PAGE PROGRAM BUFFER 2 (256/264 BYTES) BUFFER 2 WRITE Completes writing into selected buffer n n+1 ...

Page 40

... Main Memory Page Read CS SI (INPUT) CMD SO (OUTPUT) 23.2 Main Memory Page to Buffer Transfer (Data from Flash Page Read into Buffer (INPUT) SO (OUTPUT) AT45DB081D 40 FLASH MEMORY ARRAY MAIN MEMORY READ PAGE READ I/O INTERFACE SO ADDRESS FOR BINARY PAGE SIZE A15-A8 A19-A16 ...

Page 41

... HIGH-IMPEDANCE SO 3596F–DFLASH–8/07 BINARY PAGE SIZE 15 DON'T CARE + BFA8-BFA0 CMD X X..X, BFA9 ADDRESS BITS 32 DON'T CARE BITS MSB MSB ADDRESS BITS A19 - MSB MSB AT45DB081D 1 Dummy Byte BFA7 DATA BYTE MSB BIT 2047/2111 OF PAGE DON'T CARE DATA BYTE MSB n+1 ...

Page 42

... Continuous Array Read (Low Frequency: Opcode 03H SCK MSB HIGH-IMPEDANCE SO 24.4 Main Memory Page Read (Opcode: D2H SCK OPCODE MSB HIGH-IMPEDANCE SO 24.5 Buffer Read (Opcode D4H or D6H SCK OPCODE MSB HIGH-IMPEDANCE SO AT45DB081D OPCODE ADDRESS BITS A19- MSB ADDRESS BITS 32 DON'T CARE BITS MSB MSB 6 7 ...

Page 43

... ADDRESS BITS BINARY PAGE SIZE = 16 DON'T CARE + BFA7-BFA0 STANDARD DATAFLASH PAGE SIZE = OPCODE 15 DON'T CARE + BFA8-BFA0 MSB OPCODE DON'T CARE MSB OPCODE DON'T CARE MSB AT45DB081D DATA BYTE MSB MSB DATA BYTE MSB MSB DATA BYTE MSB MSB 43 ...

Page 44

... Read Security Register (Opcode 77H SCK MSB HIGH-IMPEDANCE SO 24.10 Status Register Read (Opcode D7H SCK SI 1 MSB HIGH-IMPEDANCE SO 24.11 Manufacturer and Device Read (Opcode 9FH) CS SCK SI HIGH-IMPEDANCE SO Note: Each transition AT45DB081D OPCODE DON'T CARE MSB OPCODE STATUS REGISTER DATA MSB ...

Page 45

... The algorithm above shows the programming of a single page. The algorithm will be repeated sequentially for each page within the entire array. 3596F–DFLASH–8/07 START provide address (82H, 85H) END AT45DB081D and data BUFFER WRITE (84H, 87H) BUFFER TO MAIN MEMORY PAGE PROGRAM (83H, 86H) ...

Page 46

... Other algorithms can be used to rewrite portions of the Flash array. Low-power applications may choose to wait until 10,000 cumulative page erase and program operations have accumulated before rewriting all pages of the sector. See application note AN-4 (“Using Atmel’s Serial DataFlash”) for more details. AT45DB081D 46 START ...

Page 47

... Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC) 8M1-A 8-lead Very Thin Micro Lead-frame Package (MLF) 3596F–DFLASH–8/07 Ordering Code AT45DB081D-SSU AT45DB081D-SU AT45DB081D-MU AT45DB081D-SSU-2.5 AT45DB081D-SU-2.5 AT45DB081D-MU-2.5 Package Type AT45DB081D Package Operation Range 8S1 8S2 8M1-A Industrial (-40° ...

Page 48

... Packaging Information 27.1 8S1 – JEDEC SOIC TOP VIEW e e SIDE VIEW Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R AT45DB081D TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing ...

Page 49

... San Jose, CA 95131 R 3596F–DFLASH–8/ TOP VIEW TOP VIEW SIDE VIEW SIDE VIEW TITLE 8S2, 8-lead, 0.209" Body, Plastic Small Outline Package (EIAJ) AT45DB081D θ θ END VIEW END VIEW COMMON DIMENSIONS (Unit of Measure = mm) MIN NOM MAX SYMBOL A 1.70 2.16 A1 0.05 ...

Page 50

... MLF BOTTOM VIEW 2325 Orchard Parkway San Jose, CA 95131 R AT45DB081D Pin 1 ID TOP VIEW A2 A 0.45 D2 Pin #1 Notch (0. TITLE 8M1-A, 8-pad 1.00 mm Body, Very Thin Dual Flat Package No Lead (MLF) SIDE VIEW A3 A1 0.08 C COMMON DIMENSIONS (Unit of Measure = mm) ...

Page 51

... Changed various timing parameters under Removed RDY/BUSY pin references. Removed SER/BYTE statement from SI and SO pin descriptions in Table 2-1. Added additional text to “power of 2” binary page size option. Changed t from 50 µ µs. VSCL Changed t from 30 µ µs. RDPD AT45DB081D Table 18-4. 51 ...

Page 52

... Use Block Erase (opcode 50H alternative. The Block Erase function is not affected by the Chip Erase issue. 29.1.3 Resolution The Chip Erase feature may be fixed with a new revision of the device. Please contact Atmel for the estimated availability of devices with the fix. AT45DB081D 52 3596F–DFLASH–8/07 ...

Page 53

... Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI- TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT ...

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