M24C02-WMN6 STMicroelectronics, M24C02-WMN6 Datasheet - Page 5
![IC EEPROM 2KBIT 400KHZ 8SOIC](/photos/1/38/13851/497-8-soic_sml.jpg)
M24C02-WMN6
Manufacturer Part Number
M24C02-WMN6
Description
IC EEPROM 2KBIT 400KHZ 8SOIC
Manufacturer
STMicroelectronics
Datasheet
1.M24C01-WMN6TP.pdf
(39 pages)
Specifications of M24C02-WMN6
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
2K (256 x 8)
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
M24C02-WMN6
Manufacturer:
TI
Quantity:
1 230
Part Number:
M24C02-WMN6
Manufacturer:
ST
Quantity:
20 000
Part Number:
M24C02-WMN6T
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
M24C02-WMN6TP
Manufacturer:
ANPEC
Quantity:
17 600
Company:
Part Number:
M24C02-WMN6TP
Manufacturer:
ST
Quantity:
5 000
M24C16, M24C08, M24C04, M24C02, M24C01
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8-pin package connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
M24C08-F WLCSP and thin WLCSP connections
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Maximum R
I²C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 13
Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 14
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
WLCSP (0.5 mm) and Thin WLCSP (0.3 mm) 0.4 mm pitch 5 bumps,
SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 28
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
TSSOP8 – 8 lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 30
PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 31
(top view, marking side, with balls on the underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
P
value versus bus parasitic capacitance (C) for an I²C bus . . . . . . . . . . . . . . 9
Doc ID 5067 Rev 16
List of figures
5/39