LNK616PG Power Integrations, LNK616PG Datasheet - Page 16
![IC OFFLINE SWIT OTP CV/CC 8DIP](/photos/7/32/73225/lnk616pg_sml.jpg)
LNK616PG
Manufacturer Part Number
LNK616PG
Description
IC OFFLINE SWIT OTP CV/CC 8DIP
Manufacturer
Power Integrations
Series
LinkSwitch®-IIr
Type
Off Line Switcherr
Datasheet
1.LNK603DG.pdf
(18 pages)
Specifications of LNK616PG
Mfg Application Notes
LinkSwitch-II Family, Appl Note AN-44
Output Isolation
Isolated
Frequency Range
58 ~ 72kHz
Voltage - Output
700V
Power (watts)
6.1W
Operating Temperature
-40°C ~ 150°C
Package / Case
8-DIP (0.300", 7.62mm), 7 Leads
Output Voltage
700 V
Input / Supply Voltage (max)
9 V
Input / Supply Voltage (min)
- 0.3 V
Duty Cycle (max)
55 %
Switching Frequency
65 KHz
Supply Current
520 uA
Operating Temperature Range
- 40 C to + 150 C
Mounting Style
Through Hole
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 40 C
Output Current
654 mA
Output Power
6.1 W
For Use With
596-1235 - KIT REF DESIGN LINKSWITCH 2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
596-1233-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LNK616PG
Manufacturer:
POWER
Quantity:
15 000
Part Number:
LNK616PG
Manufacturer:
POWER
Quantity:
20 000
Part Ordering Information
Rev. F 01/10
D07C
16
2X
0.10 (0.004)
0.25 (0.010)
LNK603-606/613-616
0.10 (0.004) C
1.35 (0.053)
1.75 (0.069)
Reference
Solder Pad
Dimensions
1.27 (0.050) BSC
2
LNK 615
3.90 (0.154) BSC
1.27 (0.050)
Pin 1 ID
D
2.00 (0.079)
4
D G - TL
B
(0.049 - 0.065)
1.25 - 1.65
1
+
8
4.90 (0.193) BSC
A
+
2
• LinkSwitch Product Family
• II Series Number
• Package Identifier
• Package Material
• Tape & Reel and Other Options
Blank
4
5
TL
4.90 (0.193)
P
D
4
G
G
+
+
6.00 (0.236) BSC
Plastic Surface Mount DIP
Plastic DIP
Plastic SO-8
GREEN: Halogen Free and RoHS Compliant
Standard Configurations
Tape & Reel, 1 k pcs minimum for G Package. 2.5 k pcs for D Package. Not available
for P Package.
0.10 (0.004) C
7X 0.31 - 0.51 (0.012 - 0.020)
0.60 (0.024)
7X
D
C
0.25 (0.010) M C A-B D
2X
SEATING PLANE
0.10 (0.004) C
SO-8C
0.20 (0.008) C
A-B
Notes:
1. JEDEC reference: MS-012.
2. Package outline exclusive of mold flash and metal burr.
3. Package outline inclusive of plating thickness.
4. Datums A and B to be determined at datum plane H.
5. Controlling dimensions are in millimeters. Inch dimensions
2X
are shown in parenthesis. Angles in degrees.
SEATING
PLANE
1.04 (0.041) REF
C
H
0.40 (0.016)
1.27 (0.050)
0.17 (0.007)
0.25 (0.010)
www.powerint.com
DETAIL A
0 - 8
0.25 (0.010)
BSC
o
DETAIL A
PI-4526-040207
GAUGE
PLANE