LNK606GG-TL Power Integrations, LNK606GG-TL Datasheet - Page 15
![IC OFFLINE SWIT CV/CC HV 8SOIC](/photos/28/21/282159/lnk60xdg_sml.jpg)
LNK606GG-TL
Manufacturer Part Number
LNK606GG-TL
Description
IC OFFLINE SWIT CV/CC HV 8SOIC
Manufacturer
Power Integrations
Series
LinkSwitch®-IIr
Type
Off Line Switcherr
Datasheet
1.LNK603DG.pdf
(18 pages)
Specifications of LNK606GG-TL
Mfg Application Notes
LinkSwitch-II Family, Appl Note AN-44
Output Isolation
Isolated
Frequency Range
59 ~ 73kHz
Voltage - Output
700V
Power (watts)
6.1W
Operating Temperature
-40°C ~ 150°C
Package / Case
8-SMD Gull Wing, 7 Leads
Output Voltage
700 V
Input / Supply Voltage (max)
9 V
Input / Supply Voltage (min)
- 0.3 V
Duty Cycle (max)
55 %
Switching Frequency
66 KHz
Supply Current
520 uA
Operating Temperature Range
- 40 C to + 150 C
Mounting Style
Through Hole
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 40 C
Output Current
654 mA
Output Power
6.1 W
For Use With
596-1235 - KIT REF DESIGN LINKSWITCH 2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LNK606GG-TL
Manufacturer:
POWER
Quantity:
20 000
www.powerint.com
.240 (6.10)
.260 (6.60)
.125 (3.18)
.145 (3.68)
-T-
.100 (2.54) BSC
.032 (.81)
.037 (.94)
Pin 1
-D-
-E-
.125 (3.18)
.145 (3.68)
.240 (6.10)
.260 (6.60)
SEATING
PLANE
-E-
Pin 1
-D-
.014 (.36)
.022 (.56)
⊕
.367 (9.32)
.387 (9.83)
D S .004 (.10)
⊕
.100 (2.54) (BSC)
D S .004 (.10)
.367 (9.32)
.387 (9.83)
.048 (1.22)
.053 (1.35)
.048 (1.22)
.053 (1.35)
⊕
T E D S .010 (.25) M
.137 (3.48)
.009 (.23)
MINIMUM
⊕
SMD-8C (G Package)
E S
.057 (1.45)
.068 (1.73)
.057 (1.45)
.068 (1.73)
.372 (9.45)
.388 (9.86)
.120 (3.05)
.140 (3.56)
.137 (3.48)
DIP-8C (P Package)
(NOTE 5)
MINIMUM
MINIMUM
(NOTE 6)
.015 (.38)
.010 (.25)
.004 (.10)
.012 (.30)
Pin 1
Notes:
1. Package dimensions conform to JEDEC specification
2. Controlling dimensions are inches. Millimeter sizes are
3. Dimensions shown do not include mold flash or other
4. Pin locations start with Pin 1, and continue counter-clock-
5. Minimum metal to metal spacing at the package body for
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
Solder Pad Dimensions
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
shown in parentheses.
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 3 is omitted.
the omitted lead location is .137 inch (3.48 mm).
perpendicular to plane T.
.046 .060
.086
.004 (.10)
.008 (.20)
.015 (.38)
.186
.286
.300 (7.62) BSC
.036 (0.91)
.044 (1.12)
.300 (7.62)
.390 (9.91)
(NOTE 7)
.060 .046
.080
.420
LNK603-606/613-616
0 -
°
8
Notes:
1. Controlling dimensions are
2. Dimensions shown do not
3. Pin locations start with Pin 1,
4. Minimum metal to metal
5. Lead width measured at
6. D and E are referenced
°
inches. Millimeter sizes are
shown in parentheses.
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
and continue counter-clock-
wise to Pin 8 when viewed
from the top. Pin 3 is omitted.
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
package body.
datums on the package
body.
PI-3933-101507
PI-4015-101507
G08C
P08C
Rev. F 01/10
15