TOP234GN Power Integrations, TOP234GN Datasheet - Page 35

• Manufacturer Part Number: TOP234GN
• Description: IC OFFLINE SWIT OVP UVLO 8SMD
• Manufacturer: Power Integrations
• Series: TOPSwitch®-FXr
• Type: Off Line Switcherr

Specifications of TOP234GN

• Output Isolation: Isolated
• Frequency Range: 66 ~ 132kHz
• Voltage - Output: 700V
• Power (watts): 30W
• Operating Temperature: -40°C ~ 150°C
• Package / Case: 8-SMD Gull Wing, 7 Leads
• Output Voltage: 12 V
• Input / Supply Voltage (max): 265 VAC
• Input / Supply Voltage (min): 85 VAC
• Duty Cycle (max): 78 %
• Switching Frequency: 132 KHz
• Supply Current: 1.5 mA
• Operating Temperature Range: - 40 C to + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

.245 (6.22)
.255 (6.48)
.100 (2.54) BSC
.128 (3.25)
.132 (3.35)
.032 (.81)
.037 (.94)
-T-
Pin 1
.128 (3.25)
.132 (3.35)
-E-
.245 (6.22)
.255 (6.48)
-D-
SEATING
PLANE
Pin 1
-E-
-D-
.014 (.36)
.022 (.56)
⊕
.375 (9.53)
.385 (9.78)
⊕
D S .004 (.10)
D S .004 (.10)
.375 (9.53)
.385 (9.78)
.100 (2.54) (BSC)
.048 (1.22)
.053 (1.35)
⊕
T E D S .010 (.25) M
.048 (1.22)
.053 (1.35)
.009 (.23)
⊕
.125 (3.18)
.135 (3.43)
.372 (9.45)
.388 (9.86)
E S
.057 (1.45)
.063 (1.60)
.057 (1.45)
.063 (1.60)
MINIMUM
(NOTE 6)
0.15 (.38)
(NOTE 5)
.010 (.25)
SMD-8B
DIP-8B
Heat Sink is 2 oz. Copper
.004 (.10)
.012 (.30)
Notes:
1. Package dimensions conform to JEDEC specification
2. Controlling dimensions are inches. Millimeter sizes are
3. Dimensions shown do not include mold flash or other
4. Pin locations start with Pin 1, and continue counter-clock-
5. Minimum metal to metal spacing at the package body for
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
As Big As Possible
Pin 1
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
shown in parentheses.
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
the omitted lead location is .137 inch (3.48 mm).
perpendicular to plane T.
Solder Pad Dimensions
.004 (.10)
.046 .060
.010 (.25)
.015 (.38)
.086
.300 (7.62) BSC
.186
.036 (0.91)
.044 (1.12)
.300 (7.62)
.390 (9.91)
(NOTE 7)
.286
.060 .046
.080
.420
0 -
°
8
Notes:
1. Controlling dimensions are
2. Dimensions shown do not
3. Pin locations start with Pin 1,
4. Minimum metal to metal
5. Lead width measured at
6. D and E are referenced
°
inches. Millimeter sizes are
shown in parentheses.
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
and continue counter-clock
Pin 8 when viewed from the
top. Pin 6 is omitted.
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
package body.
datums on the package
body.
TOP232-234
PI-2551-033001
PI-2546-040501
G08B
P08B
7/01
B
35