MC33363APG ON Semiconductor, MC33363APG Datasheet - Page 6

• Manufacturer Part Number: MC33363APG
• Description: IC SWIT PROG OVP UVLO HV 16DIP
• Manufacturer: ON Semiconductor

Specifications of MC33363APG

• Output Isolation: Isolated
• Frequency Range: 59 ~ 315kHz
• Voltage - Input: 9.5 ~ 40 V
• Voltage - Output: 700V
• Operating Temperature: -25°C ~ 150°C
• Package / Case: 16-DIP (0.300", 7.62mm)
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC33363APGOS

Figure 17. DW Suffix (SOP- -16L) Thermal Resistance and
100
90
80
70
60
50
40
30
3.6
3.2
2.4
1.6
0.8
Maximum Power Dissipation versus P.C.B. Copper
0
0
Figure 15. Supply Current versus Supply Voltage
0
8.0
4.0
32
24
16
0
--50
I
10
D
Figure 13. Power Switch Drain- -Source
--25
= 200 mA
On- -Resistance versus Temperature
10
L, LENGTH OF COPPER (mm)
R
θJA
V
C
CC
0
T
T
P
A
, SUPPLY VOLTAGE (V)
D(max)
= 390 pF
, AMBIENT TEMPERATURE (C)
20
Pulse tested at 5.0 ms with < 1.0% duty cycle
so that T
Length
25
for T
20
C
A
J
Printed circuit board heatsink example
T
Graphs represent symmetrical layout
= 50C
is as close to T
L
= 2.0 nF
30
50
Copper
2.0 oz
L
75
30
R
Pin 1 = Open
Pin 4, 5, 10, 11,
12, 13 = GND
T
A
T
A
40
= 25C
= 10 k
as possible.
100
3.0 mm
125
http://onsemi.com
50
40
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
150
6
Maximum Power Dissipation versus P.C.B. Copper Length
100
1.0
100
10
160
120
80
60
40
20
0.01
80
40
0
Figure 18. P Suffix (DIP- -16) Thermal Resistance and
0
1.0
0
L = 12.7 mm of 2.0 oz.
copper. Refer to Figures
17 and 18.
C
Drain- -Source Capacitance versus Voltage
OSS
Figure 16. DW and P Suffix Transient
measured at 1.0 MHz with 50 mVpp.
10
0.1
P
R
V
D(max)
Figure 14. Power Switch
θJA
DS
L, LENGTH OF COPPER (mm)
Thermal Resistance
, DRAIN--SOURCE VOLTAGE (V)
10
for T
20
A
t, TIME (s)
= 70C
1.0
Printed circuit board heatsink example
Graphs represent symmetrical layout
L
30
Copper
2.0 oz
100
L
10
40
V
T
A
CC
= 25C
= 20 V
3.0 mm
100
1000
50
5.0
4.0
3.0
2.0
1.0
0