LT3092ETS8#TRMPBF Linear Technology, LT3092ETS8#TRMPBF Datasheet - Page 19
LT3092ETS8#TRMPBF
Manufacturer Part Number
LT3092ETS8#TRMPBF
Description
IC CURRENT SOURCE 1% TSOT23-8
Manufacturer
Linear Technology
Datasheet
1.LT3092ETS8TRMPBF.pdf
(22 pages)
Specifications of LT3092ETS8#TRMPBF
Function
Current Source
Accuracy
±1%
Voltage - Input
1.2 ~ 40 V
Current - Output
200mA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
TSOT-23-8, TSOT-8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Sensing Method
-
Other names
LT3092ETS8#TRMPBFTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PACKAGE DESCRIPTION
3.5 ±0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
2.15 ±0.05
(6.70 – 7.30)
.264 – .287
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
(3.30 – 3.71)
.130 – .146
(1.80)
.071
MAX
(2.30)
.0905
BSC
2.38 ±0.05
(2 SIDES)
0.50 BSC
(6.30 – 6.71)
(2.90 – 3.15)
(0.60 – 0.84)
.248 – .264
.114 – .124
.024 – .033
(4.60)
0.675 ±0.05
.181
BSC
PACKAGE
OUTLINE
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
(Reference LTC DWG # 05-08-1630)
TOP MARK
3-Lead Plastic SOT-223
(NOTE 6)
PIN 1
0.200 REF
DD Package
ST Package
(0.84 – 1.04)
.033 – .041
(0.31)
.012
MIN
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
MAX
10
.059 MAX
10 – 16
.059 MAX
RECOMMENDED SOLDER PAD LAYOUT
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
(0.0203 – 0.1016)
0.00 – 0.05
.0008 – .0040
.129 MAX
.181 MAX
1.65 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
.039 MAX
0.25 ± 0.05
R = 0.115
10 – 16
.090
BSC
TYP
4
5
.248 BSC
ST3 (SOT-233) 0502
2.38 ±0.10
(2 SIDES)
(0.25 – 0.36)
.010 – .014
LT3092
8
1
0.50 BSC
0.38 ± 0.10
19
(DD) DFN 1203
3092fb