NIS5132MN1TXG ON Semiconductor, NIS5132MN1TXG Datasheet - Page 11
![IC ELECTRONIC FUSE 10DFN](/photos/1/39/13931/10-dfn_pkg_sml.jpg)
NIS5132MN1TXG
Manufacturer Part Number
NIS5132MN1TXG
Description
IC ELECTRONIC FUSE 10DFN
Manufacturer
ON Semiconductor
Datasheet
1.NIS5132MN1TXG.pdf
(11 pages)
Specifications of NIS5132MN1TXG
Function
Electronic Fuse
Voltage - Input
9 ~ 18 V
Current - Output
3.6A
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
10-VFDFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Accuracy
-
Sensing Method
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NIS5132MN1TXG
Manufacturer:
ON/安森美
Quantity:
20 000
PUBLICATION ORDERING INFORMATION
10X
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
2X
2X
REFERENCE
0.10 C
0.05 C
10X
10X
0.10 C
0.08 C
0.15 C
K
PIN 1
L
0.15 C
A B
NOTE 3
10X
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
DETAIL B
b
10
BOTTOM VIEW
1
SIDE VIEW
TOP VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
e
D2
D
5
6
(A3)
A1
DETAIL A
A
B
E
E2
A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
C
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
0.5651
SEATING
PLANE
10X
MOLD CMPD
DFN10, 3 x 3, 0.5P
http://onsemi.com
L1
2.1746
CASE 485C−01
0.3008
A1
ISSUE B
Bottom View
10X
(Optional)
DETAIL A
SOLDERING FOOTPRINT*
11
É É É
É É É
É É É
Side View
(Optional)
DETAIL B
EDGE OF PACKAGE
2.6016
EXPOSED Cu
DIMENSIONS: MILLIMETERS
A3
0.5000 PITCH
1.8508
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
6. DETAILS A AND B SHOW OPTIONAL VIEWS
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
DIM
A1
A3
D2
E2
L1
A
D
E
K
b
e
L
MILLIMETERS
MIN
0.80
0.00
0.18
2.40
1.70
0.35
0.00
3.3048
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.19 TYP
MAX
1.00
0.05
0.30
2.60
1.90
0.45
0.03
NIS5132/D