LTC4257CDD Linear Technology, LTC4257CDD Datasheet - Page 19
![IC CONTROLLER POE INTERFACE 8DFN](/photos/7/2/70256/161-8-dfn_sml.jpg)
LTC4257CDD
Manufacturer Part Number
LTC4257CDD
Description
IC CONTROLLER POE INTERFACE 8DFN
Manufacturer
Linear Technology
Type
Power over Ethernet Switch (PoE)r
Datasheet
1.LTC4257CS8PBF.pdf
(20 pages)
Specifications of LTC4257CDD
Applications
IP Phones, Power over LAN, Network Routers and Switches
Internal Switch(s)
Yes
Current Limit
350mA
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
8-WFDFN Exposed Pad
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC4257CDD
Manufacturer:
LT
Quantity:
10 000
Company:
Part Number:
LTC4257CDD-1
Manufacturer:
LT
Quantity:
10 000
PACKAGE DESCRIPTIO
.030 ±.005
3.5 ±0.05
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
TYP
.245
MIN
2.15 ±0.05
RECOMMENDED SOLDER PAD LAYOUT
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
.050 BSC
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
(MILLIMETERS)
INCHES
2.38 ±0.05
(2 SIDES)
.045 ±.005
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
.160 ±.005
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50
BSC
(5.791 – 6.197)
.228 – .244
U
0.675 ±0.05
8-Lead Plastic Small Outline (Narrow .150 Inch)
PACKAGE
OUTLINE
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
(Reference LTC DWG # 05-08-1610)
1
8
TOP MARK
(NOTE 6)
(4.801 – 5.004)
.189 – .197
PIN 1
7
2
0.200 REF
DD Package
NOTE 3
S8 Package
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
6
3
5
4
(3.810 – 3.988)
.150 – .157
NOTE 3
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
(0.203 – 0.254)
.008 – .010
(1.346 – 1.752)
(0.355 – 0.483)
0.00 – 0.05
.053 – .069
.014 – .019
TYP
1.65 ± 0.10
(0.254 – 0.508)
(2 SIDES)
.010 – .020
(0.406 – 1.270)
BOTTOM VIEW—EXPOSED PAD
.016 – .050
0.25 ± 0.05
R = 0.115
× 45°
TYP
4
5
2.38 ±0.10
(2 SIDES)
LTC4257
(1.270)
.050
BSC
0°– 8° TYP
8
1
0.50 BSC
(0.101 – 0.254)
.004 – .010
0.38 ± 0.10
19
(DD8) DFN 1203
4257fb
SO8 0303