LTC4301IMS8#PBF Linear Technology, LTC4301IMS8#PBF Datasheet - Page 11

• Manufacturer Part Number: LTC4301IMS8#PBF
• Description: IC BUFFER BUS HOTSWAP 2WR 8MSOP
• Manufacturer: Linear Technology
• Type: Hot-Swap Switchr

Specifications of LTC4301IMS8#PBF

• Applications: General Purpose, Buffer/Bus Extender
• Internal Switch(s): Yes
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGE DESCRIPTIO
(.0165 ± .0015)
3.5 ±0.05
0.42 ± 0.038
TYP
2.15 ±0.05
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
0.889 ± 0.127
(.0256)
(.035 ± .005)
(.126 – .136)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.65
3.20 – 3.45
BSC
0.50
BSC
U
GAUGE PLANE
PACKAGE
OUTLINE
(.007)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.675 ±0.05
0.18
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1660)
(Reference LTC DWG # 05-08-1698)
TOP MARK
(NOTE 6)
8-Lead Plastic MSOP
(.010)
0.254
PIN 1
0.200 REF
MS8 Package
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
DD Package
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
DETAIL “A”
DETAIL “A”
0° – 6° TYP
(.021 ± .006)
0.53 ± 0.152
SEATING
3.00 ±0.10
0.75 ±0.05
PLANE
(4 SIDES)
0.00 – 0.05
(.193 ± .006)
4.90 ± 0.152
(.118 ± .004)
3.00 ± 0.102
(.009 – .015)
0.22 – 0.38
(NOTE 3)
1.65 ± 0.10
(2 SIDES)
TYP
(.043)
1.10
MAX
BOTTOM VIEW—EXPOSED PAD
(.0256)
0.25 ± 0.05
R = 0.115
0.65
BSC
1
8
TYP
4
5
7 6 5
2 3
2.38 ±0.10
(2 SIDES)
4
LTC4301
(.118 ± .004)
3.00 ± 0.102
8
1
(.0205)
0.50 BSC
(NOTE 4)
(.034)
0.52
REF
0.86
REF
0.127 ± 0.076
(.005 ± .003)
0.38 ± 0.10
MSOP (MS8) 0204
(DD8) DFN 1203
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