LTC4211IMS8#TRPBF Linear Technology, LTC4211IMS8#TRPBF Datasheet - Page 35

• Manufacturer Part Number: LTC4211IMS8#TRPBF
• Description: IC CONTROLLER HOT SWAP 8-MSOP
• Manufacturer: Linear Technology
• Type: Hot-Swap Controllerr

Specifications of LTC4211IMS8#TRPBF

• Applications: General Purpose
• Internal Switch(s): No
• Voltage - Supply: 2.5 V ~ 16.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Linear Misc Type: Positive Low Voltage
• Family Name: LTC4211
• Package Type: MSOP
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 16.5V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Product Depth (mm): 3mm
• Product Height (mm): 0.86mm
• Product Length (mm): 3mm
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGE DESCRIPTIO
(0.203 – 0.254)
**
0.008 – 0.010
*
DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
(.0120 ± .0015)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.305 ± 0.038
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
(.0165 ± .0015)
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
0.42 ± 0.04
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
TYP
TYP
(0.254 – 0.508)
(.206)
0.010 – 0.020
5.23
MIN
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
RECOMMENDED SOLDER PAD LAYOUT
(0.406 – 1.270)
0.016 – 0.050
× 45°
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
0°– 8° TYP
0.889 ± 0.127
(.0256)
3.2 – 3.45
(.035 ± .005)
(.126 – .136)
0.65
BSC
3.2 – 3.45
(.0197)
0.50
BSC
U
8-Lead Plastic Small Outline (Narrow .150 Inch)
(1.346 – 1.752)
0.053 – 0.069
(0.355 – 0.483)
0.014 – 0.019
TYP
(Reference LTC DWG # 05-08-1660)
(Reference LTC DWG # 05-08-1661)
(Reference LTC DWG # 05-08-1610)
GAUGE PLANE
(.077)
0.18
GAUGE PLANE
(.007)
0.18
10-Lead Plastic MSOP
8-Lead Plastic MSOP
MS8 Package
(.010)
0.254
MS Package
S8 Package
(.010)
0.254
DETAIL “A”
DETAIL “A”
DETAIL “A”
(1.270)
DETAIL “A”
0.050
BSC
(0.101 – 0.254)
0° – 6° TYP
0.004 – 0.010
0° – 6° TYP
(.021 ± .006)
0.53 ± 0.015
(.021 ± .006)
0.53 ± 0.01
SEATING
PLANE
SEATING
(5.791 – 6.197)
0.228 – 0.244
PLANE
(.192 ± .004)
(.118 ± .004)
3.00 ± 0.102
(.009 – .015)
4.88 ± 0.1
0.22 – 0.38
(NOTE 3)
(.118 ± .004)
3.00 ± 0.102
(.007 – .011)
(.192 ± .004)
0.17 – 0.27
(NOTE 3)
4.88 ± 0.10
(.043)
MAX
1.10
8
1
(.043)
1.10
MAX
(.0256)
(4.801 – 5.004)
0.65
BCS
0.189 – 0.197*
(.0197)
1
8
2
7
0.50
10
TYP
1 2 3 4 5
7 6 5
2 3
9
8
6
3
7 6
4
5
4
(.118 ± .004)
3.00 ± 0.102
(.206)
(.034)
0.52
(.118 ± .004)
REF
3.00 ± 0.102
NOTE 4
0.86
REF
(.005 ± .002)
0.497 ± 0.076
(.0196 ± .003)
0.13 ± 0.05
(.034)
(3.810 – 3.988)
0.86
NOTE 4
REF
MSOP (MS8) 0102
(.005 ± .002)
0.150 – 0.157**
0.13 ± 0.05
MSOP (MS) 1001
REF
SO8 1298
LTC4211
35
4211fa