SY84402LMG TR Micrel Inc, SY84402LMG TR Datasheet
SY84402LMG TR
Specifications of SY84402LMG TR
SY84402LMG TR
Related parts for SY84402LMG TR
SY84402LMG TR Summary of contents
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... All datasheets and support documentation can be found on Micrel’s web site at: www.micrel.com. ___________________________________________________________________________________________________________ Typical Application MicroLeadFrame and MLF are registered trademarks of Amkor Technology, Inc. Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 ( October 2009 SY84402L 4.25Gbps VCSEL Driver Features • ...
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Micrel, Inc. Ordering Information Part Number SY84402LMGTR (1) Note: 1. Pb-Free package is recommended for new designs. Pin Configuration Pin Description Pin Pin Name Pin Function Number 1 GND GND and Exposed pad must be tied to most negative supply. ...
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Micrel, Inc. Absolute Maximum Ratings Supply Voltage (V ) .................................. –0.5V to +4.0V CC Input Voltage (V ) .......................................... –0. LVPECL Output Current (I ) OUT Continuous .......................................................... 50mA Surge ................................................................. 100mA Input Current Source or sink ...
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Micrel, Inc. AC Electrical Characteristics V = +3.3V ±10% and GND = 0V Symbol Parameter Maximum Data Rate Output Rise/Fall Times r f (20% to 80%) Notes: 6. Output with VCTRL = V – 1.42V. ...
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Micrel, Inc. Functional Block Diagram Functional Description As shown on the block diagram above, the driver is composed from an input buffer, Enable and polarity block, and output buffer. In order to accommodate VCSELs with different polarity and keep the ...
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Micrel, Inc. Input and Output Stages Figure 1a. Simplified Driver Input Stage Interfacing Driver Input to Different Logic Drivers Figure 2a. AC-Coupled Input to LVPECL Figure 2c. AC-Coupled Input to CML October 2009 Figure 1b. Simplified Driver Output Stage Figure ...
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Micrel, Inc. Package Information Package Notes: 1. Package meets Level 2 qualification. 2. All parts are dry-packaged before shipment. 3. Exposed pads must be soldered to a plane equivalent to device GND for proper thermal management. MICREL, INC. 2180 FORTUNE ...