MAX3273ETG+T Maxim Integrated Products, MAX3273ETG+T Datasheet - Page 12

• Manufacturer Part Number: MAX3273ETG+T
• Description: IC LASR DRVR 2.7GBPS 3.6V 24TQFN
• Manufacturer: Maxim Integrated Products
• Type: Laser Diode Driver (Fiber Optic)r

Specifications of MAX3273ETG+T

• Data Rate: 2.7Gbps
• Number Of Channels: 1
• Voltage - Supply: 3.14 V ~ 3.6 V
• Current - Supply: 30mA
• Current - Modulation: 60mA
• Current - Bias: 100mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 24-TQFN Exposed Pad
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figures 4 and 5 show simplified input and output cir-
cuits for the MAX3273 laser driver. If dice are used,
replace package parasitic elements with bondwire par-
asitic elements.
For high-current density and reliable operation, the
MAX3273 uses gold metalization. Make connections to
the die with gold wire only, using ball-bonding tech-
niques. Wedge bonding is not recommended. Die-pad
size is 4 mils (100µm) square, and die thickness is 14
mils (350µm).
To minimize inductance, keep the connections between
the MAX3273 output pins and laser diode as close as
possible. Optimize the laser-diode performance by
placing a bypass capacitor as close as possible to the
laser anode. Use good high-frequency layout tech-
niques and multilayer boards with uninterrupted ground
planes to minimize EMI and crosstalk.
+3.3V, 2.5Gbps Low-Power Laser Driver
12
Figure 4. Simplified Input Circuit
IN +
IN-
______________________________________________________________________________________
0.9nH
0.9nH
PACKAGE
0.1pF
0.1pF
V
CC
V
CC
Layout Considerations
5kΩ
5kΩ
16kΩ
24kΩ
Wire-Bonding Die
Interface Models
V
CC
Using the MAX3273 laser driver alone does not ensure
that a transmitter design is compliant with IEC 825. The
entire transmitter circuit and component selections
must be considered. Customers must determine the
level of fault tolerance required by their application,
recognizing that Maxim products are not designed or
authorized for use as components in systems intended
for surgical implant into the body, for applications
intended to support or sustain life, or for any other
application where the failure of a Maxim product could
create a situation where personal injury or death may
occur.
TRANSISTOR COUNT: 1672
PROCESS: SiGe
ISOLATED SUBSTRATE
Figure 5. Simplified Output Circuit
Laser Safety and IEC 825
V
CC
Chip Information
PACKAGE
0.1pF
0.1pF
0.9nH
0.9nH
OUT+
OUT-