MAX3863ETJ+T Maxim Integrated Products, MAX3863ETJ+T Datasheet - Page 11

• Manufacturer Part Number: MAX3863ETJ+T
• Description: IC LASR DRVR 2.7GBPS 3.6V 32TQFN
• Manufacturer: Maxim Integrated Products
• Type: Laser Diode Driver (Fiber Optic)r

Specifications of MAX3863ETJ+T

• Data Rate: 2.7Gbps
• Number Of Channels: 1
• Voltage - Supply: 3.15 V ~ 3.6 V
• Current - Supply: 58mA
• Current - Modulation: 80mA
• Current - Bias: 100mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-WFQFN Exposed Pad
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

To minimize loss and crosstalk, keep connections
between the MAX3863 output and the laser diode as
short as possible. Use good high-frequency layout
techniques and multilayer boards with uninterrupted
ground plane to minimize EMI and crosstalk. Circuit
boards should be made using low-loss dielectrics. Use
controlled-impedance lines for the clock and data
inputs, as well as the module output.
Using the MAX3863 laser driver alone does not ensure
that a transmitter design is compliant with IEC825. The
entire transmitter circuit and component selections
must be considered. Determine the level of fault toler-
ance required by each application and recognize that
Maxim products are not designed or authorized for use
as components in systems intended for surgical im-
plant into the body, for applications intended to support
or sustain life, or for any other application where the
failure of a Maxim product could create a situation
where personal injury or death may occur.
Figure 4. Laser Power vs. Current for a Change in Temperature
POWER
LASER
P
AVG
P1
P0
I
I
K
MOD
MODS
Applications Information
=
______________________________________________________________________________________
200
I
I
MOD1
=
BIAS1
T1
=
I
×
MODS
Laser Safety and IEC 825
200
2.7Gbps Laser Driver with Modulation
500
Layout Considerations
×
+
+
R
R
K I
MODSET
MODCOMP
1 2
×
5
.
BIAS
V
I
I
BIAS2
MOD2
T2
LASER CURRENT
The exposed pad on the 32-pin QFN provides a very
low thermal resistive path for heat removal from the IC.
The pad is also electrical ground on the MAX3863 and
must be soldered to the circuit board ground for proper
thermal and electrical performance. Refer to Application
Note 862: HFAN-08.1: Thermal Considerations of QFN
and Other Exposed-Paddle Packages for additional
information.
Figure 5. Equivalent Input Circuit
Figure 6. Equivalent Output Circuit
DATA+
DATA-
V
CC
50Ω
Compensation
Exposed Pad Package
MOD
GND
V
50Ω
CC
GND
MODN
I
MOD
GND
11