LM3404MA/NOPB National Semiconductor, LM3404MA/NOPB Datasheet - Page 6

IC LED DRVR HP CONST CURR 8-SOIC

LM3404MA/NOPB

Manufacturer Part Number
LM3404MA/NOPB
Description
IC LED DRVR HP CONST CURR 8-SOIC
Manufacturer
National Semiconductor
Series
PowerWise®r
Type
High Power, Constant Currentr
Datasheets

Specifications of LM3404MA/NOPB

Constant Current
Yes
Topology
PWM, Step-Down (Buck)
Number Of Outputs
1
Internal Driver
Yes
Type - Primary
Automotive
Type - Secondary
High Brightness LED (HBLED), White LED
Frequency
1MHz
Voltage - Supply
6 V ~ 42 V
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Operating Temperature
-40°C ~ 125°C
Current - Output / Channel
1A
Internal Switch(s)
Yes
Efficiency
96%
Current, Input Bias
0.1 μA
Current, Output
1.2 A
Current, Supply
625 μA
Package Type
SOIC
Regulator Type
Buck (Step-Down), Switching
Temperature, Operating, Range
-40 to +125 °C
Time, Fall
20 ns
Time, Rise
20 ns
Voltage, Input
6 to 42 V
Voltage, Output
7 V
For Use With
551600000-001A/NOPB - BOARD WEBENCH SO8/SOP LM3404/2LM3404EVAL - BOARD EVALUATION LM3404
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Output
-
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device
Other names
*LM3404MA
*LM3404MA/NOPB
LM3404MA
LM3404MATR
LM3404MATR
www.national.com
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see Electrical Characteristics.
Note 2: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Note 3: VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading.
Note 4: Typical specifications represent the most likely parametric norm at 25°C operation.
Note 5: θ
DIM COMPARATOR
V
V
I
MOSFET AND DRIVER
R
V
V
THERMAL SHUTDOWN
T
T
THERMAL RESISTANCE
θ
DIM-PU
JA
SD
SD-HYS
IH
IL
DS-ON
DR-UVLO
DR-HYS
Symbol
JA
of 50°C/W with DAP soldered to a minimum of 2 square inches of 1oz. copper on the top or bottom PCB layer.
Logic High
Logic Low
DIM Pull-up Current
Buck Switch On Resistance
BST Under-voltage Lock-out
Threshold
BST Under-voltage Lock-out
Hysteresis
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
Junction to Ambient
Parameter
DIM Increasing
DIM Decreasing
DIM = 1.5V
I
BST–SW Increasing
BST–SW Decreasing
SOIC-8 Package
PSOP-8 Package
SW
= 200mA, BST-SW = 6.3V
6
Conditions
(Note
5)
Min
2.2
1.7
0.37
Typ
400
165
155
80
25
50
3
Max
0.75
0.8
4
Units
°C/W
mV
µA
°C
°C
V
V
V

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