NCP3066PG ON Semiconductor, NCP3066PG Datasheet - Page 20
![IC LED DRIVER HIGH BRIGHT 8-DIP](/photos/6/58/65804/8-dip_626-05_sml.jpg)
NCP3066PG
Manufacturer Part Number
NCP3066PG
Description
IC LED DRIVER HIGH BRIGHT 8-DIP
Manufacturer
ON Semiconductor
Type
HBLED Driverr
Datasheet
1.NCP3066DR2G.pdf
(20 pages)
Specifications of NCP3066PG
Constant Current
Yes
Topology
PWM, Step-Down (Buck), Step-Up (Boost)
Number Of Outputs
1
Internal Driver
Yes
Type - Primary
Automotive
Type - Secondary
High Brightness LED (HBLED)
Frequency
110kHz ~ 190kHz
Voltage - Supply
3 V ~ 40 V
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Operating Temperature
0°C ~ 85°C
Current - Output / Channel
1.5A
Internal Switch(s)
Yes
Output Voltage
1 V
Output Current
1 uA
Input Voltage
0 V to 42 V
Switching Frequency
100 KHz to 250 KHz
Mounting Style
Through Hole
Duty Cycle (max)
100 %
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Output
-
Efficiency
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
NCP3066PG
NCP3066PGOS
NCP3066PGOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NCP3066PG
Manufacturer:
ON/安森美
Quantity:
20 000
PUBLICATION ORDERING INFORMATION
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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2X
8X
REFERENCE
2X
NOTE 4
PIN ONE
0.15
0.10
0.08
DETAIL A
0.15
K
C
C
C
e
C
BOTTOM VIEW
É É É É
É É
Ç Ç Ç
Ç Ç Ç Ç
Ç Ç Ç Ç Ç
SIDE VIEW
TOP VIEW
8
1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
DETAIL B
D2
D
(A3)
Ç
Ç
4
5
A1
8X
B
A
E
E2
b
8X
A
0.10 C
0.05 C
L
C
SEATING
PLANE
EXPOSED Cu
NOTE 3
A B
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
L1
Ç Ç Ç
Ç Ç Ç
É É É
http://onsemi.com
CASE 488AF−01
8 PIN DFN, 4x4
CONSTRUCTIONS
CONSTRUCTIONS
ISSUE C
DETAIL B
MOLD CMPD
ALTERNATE
DETAIL A
OPTIONAL
20
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A1
É É É É
Ç Ç
4.30
L
A3
2.39
0.80
PITCH
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONS AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. DETAILS A AND B SHOW OPTIONAL
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
PAD AS WELL AS THE TERMINALS.
CONSTRUCTIONS FOR TERMINALS.
DIM
A1
A3
D2
E2
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
L1
A
b
D
E
K
L
e
2.21
MILLIMETERS
0.80
0.00
0.25
1.91
2.09
0.20
0.30
MIN
−−−
4.00 BSC
4.00 BSC
0.80 BSC
0.20 REF
DIMENSIONS: MILLIMETERS
MAX
1.00
0.05
0.35
2.21
2.39
0.50
0.15
−−−
0.35
8X
0.63
8X
OUTLINE
PACKAGE
NCP3066/D