IR11672ASPBF International Rectifier, IR11672ASPBF Datasheet - Page 11

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IR11672ASPBF

Manufacturer Part Number
IR11672ASPBF
Description
IC MOSFET DRIVER 200V 8-SOIC
Manufacturer
International Rectifier
Series
Advanced Smart Rectifier™r
Datasheet

Specifications of IR11672ASPBF

Configuration
Half Bridge
Input Type
Non-Inverting
Delay Time
60ns
Current - Peak
2A
Number Of Configurations
1
Number Of Outputs
2
Voltage - Supply
11.4 V ~ 18 V
Operating Temperature
-25°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
*
Part Status
Active and Preferred
Package
8-Pin SOIC(NB)
Circuit
Switching Regulator Controller
Topology
Flyback / Resonant Half-Bridge
Current Mode
Discontinuous / Critical
Vcc (min)
11.4
Vcc (max)
18
Vout (max)
200
Iout (a)
+2 / -7
Switch Freq (khz)
up to 500kHz
Vgate Clamp (v)
10.7
Programmability
MOT / OVT
Enable Pin
Yes
Isleep (ua)
200
Automatic Mot Protection
Yes
Pbf
PbF Option Available
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Lead Free Status / Rohs Status
RoHS Compliant part

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IR11672ASPBF
Manufacturer:
IR
Quantity:
20 000
Company:
Part Number:
IR11672ASPBF
Quantity:
3 844
IR11672AS
Detailed Pin Description
VCC: Power Supply
This is the supply voltage pin of the IC and it is monitored by the under voltage lockout circuit. It is possible to
turn off the IC by pulling this pin below the minimum turn off threshold voltage, without damage to the IC.
To prevent noise problems, a bypass ceramic capacitor connected to Vcc and COM should be placed as
close as possible to the IR11672A. This pin is internally clamped.
OVT: Offset Voltage Trimming
The OVT pin will program the amount of input offset voltage for the turn-off threshold V
.
TH1
The pin can be optionally tied to ground, to VCC or left floating, to select 3 ranges of input offset trimming.
This programming feature allows for accommodating different R
MOSFETs.
DSon
MOT: Minimum On Time
The MOT programming pin controls the amount of minimum on time. Once V
is crossed for the first time,
TH2
the gate signal will become active and turn on the power FET. Spurious ringings and oscillations can trigger
the input comparator off. The MOT blanks the input comparator keeping the FET on for a minimum time.
The MOT is programmed between 200ns and 3us (typ.) by using a resistor referenced to COM.
EN: Enable
This pin is used to activate the IC “sleep” mode by pulling the voltage level below 1.6V (typ). In sleep mode
the IC will consume a minimum amount of current. All switching functions will be disabled and the gate will be
inactive.
VD: Drain Voltage Sense
VD is the voltage sense pin for the power MOSFET Drain. This is a high voltage pin and particular care must
be taken in properly routing the connection to the power MOSFET drain.
Additional filtering and or current limiting on this pin are not recommended as it would limit switching
performance of the IC.
VS: Source Voltage Sense
VS is the differential sense pin for the power MOSFET Source. This pin must not be connected directly to the
power ground pin (7) but must be used to create a Kelvin contact as close as possible to the power MOSFET
source pin.
GND: Ground
This is ground potential pin of the integrated control circuit.
The internal devices and gate driver are
referenced to this point.
VGATE: Gate Drive Output
This is the gate drive output of the IC. Drive voltage is internally limited and provides 2A peak source and 7A
peak sink capability. Although this pin can be directly connected to the power MOSFET gate, the use of
minimal gate resistor is recommended, especially when putting multiple FETs in parallel.
Care must be taken in order to keep the gate loop as short and as small as possible in order to achieve
optimal switching performance.
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11

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