IR2153PBF International Rectifier, IR2153PBF Datasheet - Page 2

• Manufacturer Part Number: IR2153PBF
• Description: IC DRIVER HALF BRIDGE OSC 8DIP
• Manufacturer: International Rectifier

Specifications of IR2153PBF

• Configuration: High and Low Side, Synchronous
• Input Type: Self Oscillating
• Current - Peak: 200mA
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 600V
• Voltage - Supply: 10 V ~ 15.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Current, Leakage, Offset: 50 UA
• Current, Supply: 25 mA
• Driver Type: Half Bridge
• Package Type: PDIP
• Power Dissipation: 1 W
• Temperature, Operating, Maximum: +125
• Temperature, Operating, Minimum: -40
• Thermal Resistance, Junction To Ambient: 125 degC/W
• Time, Fall, Turn-off: 100 ns
• Time, Rise, Turn-on: 150 ns
• Voltage, Offset: 600 V
• Number Of Drivers: 2
• Driver Configuration: Inverting/Non-Inverting
• Input Logic Level: CMOS
• Rise Time: 150ns
• Fall Time: 100ns
• Frequency (max): 106KHz
• Operating Supply Voltage (max): 16.8V
• Peak Output Current: 400uA
• Operating Supply Voltage (min): 10V
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Delay Time: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device
• Other names: *IR2153PBF

Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions.
Note 1:
Note 2:
Note 3:
NOTE:For new designs, we recommend
IR’s new product IRS2153D
IR2153(D)(S) & (PbF)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and
power dissipation ratings are measured under board mounted and still air conditions.
Symbol
Symbol
2
dV
Rth
V
V
V
V
V
V
I
V
I
V
V
I
P
T
CC
T
T
CC
T
RT
CC
HO
B
LO
RT
CT
s
S
D
J
B
S
S
J
L
s
/dt
JA
This IC contains a zener clamp structure between the chip V
voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source
greater than the V
Care should be taken to avoid output switching conditions where the V
more than 5V.
Enough current should be supplied to the V
voltage at this pin.
Definition
Definition
High side floating supply voltage
Steady state high side floating supply offset voltage
Supply voltage
Supply current
Junction temperature
High side floating supply voltage
High side floating supply offset voltage
High side floating output voltage
Low side output voltage
R
C
Supply current (note 1)
R
Allowable offset voltage slew rate
Maximum power dissipation @ T
Thermal resistance, junction to ambient
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
T
T
T
pin voltage
pin voltage
pin current
CLAMP
specified in the Electrical Characteristics section.
A
≤ +25°C
CC
pin of the IC to keep the internal 15.6V zener diode clamping the
(8 Lead SOIC)
(8 Lead SOIC)
(8 Lead DIP)
(8 Lead DIP)
CC
and COM which has a nominal breakdown
S
-3.0 (note 2)
node flies inductively below ground by
V
(note 3)
V
V
CC
Min.
Min.
S
B
-0.3
-0.3
-0.3
-0.3
-40
-50
-55
-55
10
—
—
—
—
—
—
-5
- 0.3
- 25
- 0.7
V
V
V
V
V
V
V
Max.
Max.
CC
CC
CC
0.625
CLAMP
CLAMP
B
B
600
125
625
125
200
150
150
300
1.0
25
50
5
+ 0.3
+ 0.3
5
+ 0.3
+ 0.3
+ 0.3
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Units
Units
°C/W
V/ns
mA
°C
°C
mA
W
V
V