IR2130STRPBF International Rectifier, IR2130STRPBF Datasheet - Page 2

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IR2130STRPBF

Manufacturer Part Number
IR2130STRPBF
Description
IC DRIVER BRIDGE 3-PHASE 28-SOIC
Manufacturer
International Rectifier
Datasheet

Specifications of IR2130STRPBF

Configuration
3 Phase Bridge
Input Type
Inverting
Delay Time
675ns
Current - Peak
200mA
Number Of Configurations
1
Number Of Outputs
3
High Side Voltage - Max (bootstrap)
600V
Voltage - Supply
10 V ~ 20 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
28-SOIC (7.5mm Width)
Module Configuration
Half Bridge
Peak Output Current
420mA
Input Delay
675ns
Output Delay
425ns
Supply Voltage Range
10V To 20V
Driver Case Style
SOIC
No. Of Pins
28
Number Of Drivers
6
Driver Configuration
Inverting
Driver Type
High and Low Side
Input Logic Level
CMOS/LSTTL/2.5V
Rise Time
125ns
Fall Time
55ns
Propagation Delay Time
850ns
Operating Supply Voltage (max)
20V
Power Dissipation
1.6W
Operating Supply Voltage (min)
10V
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
28
Package Type
SOIC W
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Note 1: Logic operational for V
(Please refer to the Design Tip DT97-3 for more details).
Note 2: All input pins, CA- and CAO pins are internally clamped with a 5.2V zener diode.
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to V
under board mounted and still air conditions. Additional information is shown in Figures 50 through 53.
IR2130/IR2132(J)(S) & (PbF)
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the
recommended conditions. All voltage parameters are absolute voltages referenced to V
with all supplies biased at 15V differential. Typical ratings at other bias conditions are shown in Figure 54.
Symbol
Symbol
2
V
V
V
V
V
V
dV
V
V
Rth
HO1,2,3
V
LO1,2,3
V
V
V
HO1,2,3
LO1,2,3
V
V
B1,2,3
S1,2,3
V
V
V
V
B1,2,3
S1,2,3
V
P
V
T
CAO
T
T
CAO
T
FLT
CA-
CC
FLT
CA-
SS
S
IN
CC
SS
D
S
L
IN
J
A
/dt
JA
High Side Floating Supply Voltage
High Side Floating Offset Voltage
High Side Floating Output Voltage
Low Side and Logic Fixed Supply Voltage
Logic Ground
Low Side Output Voltage
Logic Input Voltage (
Operational Amplifier Output Voltage
Operational Amplifier Inverting Input Voltage
Allowable Offset Supply Voltage Transient
Package Power Dissipation @ T
Thermal Resistance, Junction to Ambient
Junction Temperature
Storage Temperature
Lead Temperature (Soldering, 10 seconds)
FAULT
High Side Floating Supply Voltage
High Side Floating Offset Voltage
High Side Floating Output Voltage
Low Side and Logic Fixed Supply Voltage
Logic Ground
Low Side Output Voltage
Logic Input Voltage (
Operational Amplifier Output Voltage
Operational Amplifier Inverting Input Voltage
Ambient Temperature
FAULT
Output Voltage
Output Voltage
S
of (V
HIN1,2,3
S0
HIN1,2,3
- 5V) to (V
Definition
Definition
S0
,
. The Thermal Resistance and Power Dissipation ratings are measured
,
LIN1,2,3
A
LIN1,2,3
S0
+25°C
+ 600V). Logic state held for V
& ITRIP)
& ITRIP)
(44 Lead PLCC)
(44 Lead PLCC)
(28 Lead SOIC)
(28 Lead SOIC)
(28 Lead DIP)
(28 Lead DIP)
V
V
V
V
V
V
V
S1,2,3
V
B1,2,3
S
S1,2,3
SS
Note 1
V
SS
SS
SS
Min.
CC
Min.
of (V
-0.3
-0.3
-0.3
S0
V
V
V
V
-55
S1,2,3
-40
10
-5
0
SS
SS
SS
SS
- 0.3
- 0.3
- 0.3
- 0.3
- 25
. The V
- 0.3
- 25
+ 10
S0
- 5V) to (V
S
(V
V
V
whichever is
(V
offset rating is tested
V
V
V
V
V
V
B1,2,3
B1,2,3
SS
S1,2,3
V
V
V
CC
CC
CC
CC
CC
CC
Max.
V
Max.
lower
SS
SS
SS
625
150
150
300
V
V
1.5
1.6
2.0
600
B1,2,3
125
25
+ 15) or
50
83
78
63
20
5
+ 0.3
+ 0.3
+ 0.3)
+ 0.3
+ 0.3
+ 0.3
CC
CC
S0
+ 0.3
+ 5
+ 5
+ 5
+ 0.3
+ 20
- V
www.irf.com
BS
).
Units
Units
°C/W
°C
V/ns
V
W
°C
V

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