MC33151D ON Semiconductor, MC33151D Datasheet
MC33151D
Specifications of MC33151D
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MC33151D Summary of contents
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MC34151, MC33151 High Speed Dual MOSFET Drivers The MC34151/MC33151 are dual inverting high speed drivers specifically designed for applications that require low current digital circuitry to drive large capacitive loads with high slew rates. These devices feature low input current ...
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MAXIMUM RATINGS Rating Power Supply Voltage Logic Inputs (Note 1) Drive Outputs (Note 2) Totem Pole Sink or Source Current Diode Clamp Current (Drive Output to V Power Dissipation and Thermal Characteristics D Suffix SOIC−8 Package Case 751 Maximum Power ...
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ELECTRICAL CHARACTERISTICS ambient temperature range that applies [Note 3], unless otherwise noted.) Characteristics LOGIC INPUTS Input Threshold Voltage − Input Current − High State ( Input Current − Low State ( DRIVE ...
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V 4 Logic Input Figure 2. Switching Characteristics Test Circuit 2 2 25°C A 1.6 1.2 0.8 0.4 0 ...
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Logic Input Drive Output 10% 50 ns/DIV Figure 8. Propagation Delay 0 Source Saturation V CC (Load to Ground) -1.0 -2.0 -3.0 3.0 2.0 1.0 Sink Saturation (Load 0.2 0.4 0.6 0.8 I ...
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5 25° 0.1 1 OUTPUT LOAD CAPACITANCE (nF) L Figure 14. Drive Output Rise ...
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NPN pullup during the negative output transient, power dissipation at high frequencies can become excessive. Figures 20, 21, and 22 show a method of using external Schottky diode clamps to reduce driver power dissipation. Undervoltage Lockout An undervoltage lockout ...
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High frequency printed circuit layout techniques are imperative to prevent excessive output ringing and overshoot. Do not attempt to construct the driver circuit on wire−wrap or plug−in prototype boards. When driving large capacitive loads, the printed circuit board must contain ...
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g(on) R g(off) In noise sensitive applications, both conducted and radiated EMI can be reduced significantly by controlling the MOSFET's turn-on and turn-off times. Figure 23. Controlled MOSFET Drive 4.7 0.1 + ...
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... ORDERING INFORMATION Device MC34151DG MC34151DR2G MC34151PG MC33151DG MC33151DR2G MC33151PG MC33151VDR2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package SOIC−8 (Pb−Free) SOIC−8 (Pb−Free) PDIP−8 (Pb− ...
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NOTE 5 F TOP VIEW e 0.010 SIDE VIEW PACKAGE DIMENSIONS PDIP−8 P SUFFIX CASE 626−05 ISSUE M NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME ...
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... *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...