MDC3105LT1G ON Semiconductor, MDC3105LT1G Datasheet - Page 11

• Manufacturer Part Number: MDC3105LT1G
• Description: IC RELAY/DRVR INDUCT LOAD SOT23
• Manufacturer: ON Semiconductor
• Type: Relay/Load Driverr

Specifications of MDC3105LT1G

• Input Type: Non-Inverting
• Number Of Outputs: 1
• Current - Output / Channel: 400mA
• Current - Peak Output: 500mA
• Voltage - Supply: 6V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Supply Voltage Max: 6V
• No. Of Outputs: 1
• Output Current: 400mA
• Driver Case Style: SOT-23
• Device Type: Relay
• Filter Terminals: SMD
• No. Of Pins: 3
• Rohs Compliant: Yes
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• On-state Resistance: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MDC3105LT1GOS; MDC3105LT1GOS; MDC3105LT1GOSTR

V
D
1
G
A
3
L
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
H
B S
C
0.037
0.95
0.035
0.9
0.031
0.8
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
K
SOT−23 (TO−236)
http://onsemi.com
MDC3105LT1
CASE 318−08
ISSUE AH
11
J
SCALE 10:1
0.037
0.95
0.079
NOTES:
2.0
inches
1.
2.
3.
4.
mm
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
318−08.
DIM
STYLE 6:
A
B
C
D
G
H
K
J
L
S
V
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: INCH.
MAXIMUM LEAD THICKNESS INCLUDES LEAD
318−03 AND −07 OBSOLETE, NEW STANDARD
PIN 1. BASE
0.1102
0.0472
0.0350
0.0150
0.0701
0.0005
0.0034
0.0140
0.0350
0.0830
0.0177
2. EMITTER
3. COLLECTOR
MIN
INCHES
0.0551
0.0440
0.0200
0.0807
0.0040
0.0070
0.0285
0.0401
0.1039
0.0236
0.1197
MAX
0.013
0.085
MILLIMETERS
MIN
2.80
1.20
0.89
0.37
1.78
0.35
0.89
2.10
0.45
0.100
0.177
MAX
3.04
1.40
1.11
0.50
2.04
0.69
1.02
2.64
0.60