MC33926PNB Freescale Semiconductor, MC33926PNB Datasheet - Page 6

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MC33926PNB

Manufacturer Part Number
MC33926PNB
Description
IC H-BRIDGE THROTTLE CTRL 32-QFN
Manufacturer
Freescale Semiconductor
Type
H Bridger
Datasheet

Specifications of MC33926PNB

Input Type
Non-Inverting
Number Of Outputs
2
On-state Resistance
120 mOhm
Current - Output / Channel
5A
Current - Peak Output
11A
Voltage - Supply
5 V ~ 28 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
32-QFN
Product
H-Bridge Drivers
Rise Time
3 us
Fall Time
3 us
Supply Voltage (max)
28 V
Supply Voltage (min)
- 0.3 V
Supply Current
80 uA
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Bridge Type
H-Bridge
Maximum Turn-on Delay Time
5 ms
Minimum Operating Temperature
- 40 C
Number Of Drivers
4
Output Current
5 A
Output Voltage
7 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC33926PNB
Manufacturer:
PREESCA
Quantity:
20 000
Part Number:
MC33926PNB
0
Part Number:
MC33926PNBR2
0
Table 2. Maximum Ratings (continued)
permanent damage to the device. These parameters are not production tested.
6
33926
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Notes
Peak Package Reflow Temperature During Reflow
Approximate Junction-to-Case Thermal Resistance
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
7.
8.
9.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C for Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual R
values will vary depending on solder thickness and composition and copper trace thickness and area. Maximum current at maximum
die temperature represents ~16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the R
< 5.0°C/W for maximum current at 70°C ambient. Module thermal design must be planned accordingly.
Ratings
(7)
(9)
,
(8)
Symbol
T
R
PPRT
θJC
Analog Integrated Circuit Device Data
Value
< 1.0
250
Freescale Semiconductor
θJB
(junction-to-PC board)
θJA
must be
°
Unit
C/W
°C

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