LM629N-8/NOPB National Semiconductor, LM629N-8/NOPB Datasheet - Page 4

• Manufacturer Part Number: LM629N-8/NOPB
• Description: IC CONTROLLER PREC MOTION 28-DIP
• Manufacturer: National Semiconductor

Specifications of LM629N-8/NOPB

• Applications: DC Motor Controller, Servo
• Number Of Outputs: 1
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 28-DIP (0.600", 15.24mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -
• Voltage - Load: -
• Other names: *LM629N-8; *LM629N-8/NOPB; LM629N-8

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STATUS BYTE READ TIMING (See Figure 4)
Chip-Select Setup/Hold Time
Port-Select Setup Time
Port-Select Hold Time
Read Data Access Time
Read Data Hold Time
RD High to Hi-Z Time
COMMAND BYTE WRITE TIMING (See Figure 5)
Chip-Select Setup/Hold Time
Port-Select Setup Time
Port-Select Hold Time
Busy Bit Delay
WR Pulse Width
Write Data Setup Time
Write Data Hold Time
DATA WORD READ TIMING (See Figure 6)
Chip-Select Setup/Hold Time
Port-Select Setup Time
Port-Select Hold Time
Read Data Access Time
Read Data Hold Time
RD High to Hi-Z Time
Busy Bit Delay
Read Recovery Time
DATA WORD WRITE TIMING (See Figure 7)
Chip-Select Setup/Hold Time
Port-Select Setup Time
Port-Select Hold Time
Busy Bit Delay
WR Pulse Width
Write Data Setup Time
Write Data Hold Time
Write Recovery Time
AC Electrical Characteristics
(V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating
the device beyond the above Operating Ratings.
Note 2: When operating at ambient temperatures above 70˚C, the device must be protected against excessive junction temperatures. Mounting the package on a
printed circuit board having an area greater than three square inches and surrounding the leads and body with wide copper traces and large, uninterrupted areas
of copper, such as a ground plane, suffices. The 28-pin DIP (N) and the 24-pin surface mount package (M) are molded plastic packages with solid copper lead
frames. Most of the heat generated at the die flows from the die, through the copper lead frame, and into copper traces on the printed circuit board. The copper traces
act as a heat sink. Double-sided or multi-layer boards provide heat transfer characteristics superior to those of single-sided boards.
Note 3: In order to read the busy bit, the status byte must first be read. The time required to read the busy bit far exceeds the time the chip requires to set the busy
bit. It is, therefore, impossible to test actual busy bit delay. The busy bit is guaranteed to be valid as soon as the user is able to read it.
DD
and T
A
Timing Interval
per Operating Ratings; f
CLK
= 6 MHz; C
(Continued)
T10
T11
T12
T13
T14
T15
T16
T10
T11
T12
T13
T17
T13
T14
T15
T16
T18
T #
T7
T8
T9
T7
T8
T9
T7
T8
T9
T7
T8
T9
LOAD
= 50 pF; Input Test Signal t
4
Min
100
120
120
100
120
120
30
30
30
30
50
30
30
30
30
50
0
0
0
0
0
0
Tested Limits
r
= t
f
= 10 ns)
(Note 3)
(Note 3)
(Note 3)
Max
180
180
180
180
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns