MPC17511AEV Freescale Semiconductor, MPC17511AEV Datasheet - Page 5

• Manufacturer Part Number: MPC17511AEV
• Description: IC MOTOR DRIVER H-BRIDGE 16VMFP
• Manufacturer: Freescale Semiconductor
• Type: Half Bridge DC Motor Driverr

Specifications of MPC17511AEV

• Applications: DC Motor Driver, Stepper Motor Driver, H Bridge
• Number Of Outputs: 1
• Current - Output: 1A
• Voltage - Load: 2 V ~ 6.8 V
• Voltage - Supply: 2.7 V ~ 5.7 V
• Operating Temperature: -20°C ~ 65°C
• Mounting Type: Surface Mount
• Package / Case: 16-VMFP
• Operating Current: 3mA
• Operating Temperature Classification: Commercial
• Operating Supply Voltage (min): 2V
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage: 5 V
• Supply Current: 3 mA
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 3. Maximum Ratings
Analog Integrated Circuit Device Data
Freescale Semiconductor
damage to the device.
Notes
Motor Supply Voltage
Charge Pump Output Voltage
Logic Supply Voltage
Signal Input Voltage (EN, IN1, IN2,
Driver Output Current
ESD Voltage
Storage Temperature Range
Operating Ambient Temperature
Operating Junction Temperature
Thermal Resistance
Power Dissipation
Soldering Temperature
Peak Package Reflow Temperature During Reflow
1.
2.
3.
4.
5.
6.
7.
All voltages are with respect to ground unless otherwise noted. Exceeding the ratings may cause a malfunction or permanent
Continuous
Peak
Human Body Model
Machine Model
24 Pin QFN
16 Pin VMFP
24 Pin QFN
16 Pin VMFP
T
ESD1 testing is performed in accordance with the Human Body Model (C
accordance with the Machine Model (C
QFN24: 45 x 30 x 1 [mm] glass EPOXY board mount. (See: recommended heat pattern) VMFP16: 37 x 50 x 1.6 [mm] glass EPOXY
board mount. When the exposed pad is bonded, Rsj will not be performed.
Maximum at T
Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
A
(1)
= 25°C, 10 ms pulse width at 200 ms intervals.
(2)
(4)
(3)
A
= 25°C. When the exposed pad is bonded, Rsj will not be performed.
(5)
Rating
GIN
)
ELECTRICAL CHARACTERISTICS
ZAP
= 200 pF, R
(6)
,
(7)
MAXIMUM RATINGS
ZAP
= 0 Ω).
T
Symbol
V
V
V
SOLDER
T
ZAP
T
R
I
V
CRES
V
PPRT
V
OPK
ESD1
ESD2
T
P
STG
T
I
θJA
DD
O
IN
M
A
D
J
= 100 pF, R
ZAP
= 1500 Ω), ESD2 testing is performed in
-0.5 to V
-0.5 to 14.0
ELECTRICAL CHARACTERISTICS
-0.5 to 8.0
-65 to 150
-20 to 150
-0.5 to 7.0
-20 to 65
±1800
Value
Note 7
± 100
2500
150
830
260
1.0
3.0
50
DD
+ 0.5
MAXIMUM RATINGS
°C/W
Unit
mW
°C
°C
°C
°C
°C
V
V
V
V
A
V
17511A
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