MIC2076-2YM Micrel Inc, MIC2076-2YM Datasheet - Page 11

IC SW DISTRIBUTION 2CHAN 8SOIC

MIC2076-2YM

Manufacturer Part Number
MIC2076-2YM
Description
IC SW DISTRIBUTION 2CHAN 8SOIC
Manufacturer
Micrel Inc
Type
High Side Switchr
Datasheet

Specifications of MIC2076-2YM

Current Limit
900mA
Number Of Outputs
2
Rds (on)
140 mOhm
Internal Switch(s)
Yes
Voltage - Input
2.7 ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Power Load Switch Type
High Side
Input Voltage
5.5V
On State Resistance
0.09ohm
Thermal Protection
Yes
On / Enable Input Polarity
Active Low
No. Of Outputs
2
Short Circuit Current Limit
900mA
Input Voltage Range
2.7 to 5.5V
Number Of Switches
Dual
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Package Type
SOIC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
576-1061

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Block Diagram
Functional Description
Input and Output
IN is the power supply connection to the logic circuitry
and the drain of the output MOSFET. OUT is the source
of the output MOSFET. In a typical circuit, current flows
from IN to OUT toward the load. If V
V
bidirectional when enabled. The output MOSFET and
driver circuitry are also designed to allow the MOSFET
source to be externally forced to a higher voltage than
the drain (V
situation, the MIC2026/76 prevents undesirable current
flow from OUT to IN.
Thermal Shutdown
Thermal shutdown is employed to protect the device
from damage should the die temperature exceed safe
margins due mainly to short circuit faults. Each channel
employs its own thermal sensor. Thermal shutdown
shuts off the output MOSFET and asserts the FLG
output if the die temperature reaches 140°C and the
overheated channel is in current limit. The other channel
is not affected. If however, the die temperature exceeds
160°C, both channels will be shut off. Upon determining
a thermal shutdown condition, the MIC2076 will latch the
output off. In this case, a pull-up current source is
Micrel, Inc.
June 2010
IN
, current will flow from OUT to IN, since the switch is
OUT
> V
ENA
ENB
IN
) when the switch is disabled. In this
MIC2026/2076
CHARGE
CHARGE
PUMP
PUMP
OSC.
OUT
is greater than
MIC2026/2076 Block Diagram
SHUTDOWN
THERMAL
GND
11
UVLO
activated. This allows the output latch to automatically
reset when the load (such as a USB device) is removed.
The output can also be reset by toggling EN. Refer to
Figure 1 for timing details.
The MIC2026 will automatically reset its output when the
die temperature cools down to 120°C. The MIC2026
output and FLG signal will continue to cycle on and off
until the device is disabled or the fault is removed.
Figure 2 depicts typical timing.
Depending
temperature,
milliseconds from the incidence of the fault to the output
MOSFET being shut off. This time will be shortest in the
case of a dead short on the output.
Power Dissipation
The device’s junction temperature depends on several
factors such as the load, PCB layout, ambient
temperature, and package type. Equations that can be
used to calculate power dissipation of each channel and
junction temperature are found below:
Total power dissipation of the device will be the
summation of P
junction temperature, the following equation can be
used:
P
D
CONTROL
CONTROL
= R
GATE
GATE
DS(on)
REFERENCE
on
1.2V
etc.,
× I
D
RESPONSE
RESPONSE
OUT
for both channels. To relate this to
DELAY
DELAY
PCB
FLAG
FLAG
CURRENT
CURRENT
2
it
LIMIT
LIMIT
may
layout,
take
FLGA
OUTA
IN
OUTB
FLGB
package,
several
M9999-060410-B
MIC2026/2076
hundred
ambient

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