MC10XS3435DPNA Freescale Semiconductor, MC10XS3435DPNA Datasheet - Page 48
MC10XS3435DPNA
Manufacturer Part Number
MC10XS3435DPNA
Description
IC SWITCH HIGH SIDE QUAD 24QFN
Manufacturer
Freescale Semiconductor
Type
High Side Switchr
Datasheet
1.MC10XS3435DPNA.pdf
(51 pages)
Specifications of MC10XS3435DPNA
Number Of Outputs
4
Rds (on)
2 x 10 mOhm, 2 x 35 mOhm
Internal Switch(s)
Yes
Current Limit
5A
Voltage - Input
4 ~ 28 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
24-PQFN, 24-PowerQFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Device on Thermal Test Board
48
10XS3435
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
Material:
Outline:
Area A:
Ambient Conditions:
Figure 20. Steady State Thermal Resistance in Dependence on Heat Spreading Area;
65.00
60.00
55.00
50.00
45.00
40.00
35.00
30.00
25.00
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Cu buried traces thickness 0.035mm
76.2 mm x 114.3 mm board area,
including edge connector for thermal
testing, 74 mm x 74 mm buried
layers area
Cu heat-spreading areas on board
surface
Natural convection, still air
0
1s JEDEC Thermal Test Board with Spreading Areas
100
RJA11
Heat spreading area [sqmm]
200
RJA12=RJA21
Table 26. Thermal Resistance Performance
ambient air.
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
300
Resistance
R
Thermal
R
This device is a dual die package. Index m indicates the
θ
JA mn
θJA
is the thermal resistance between die junction and
400
Area A
(mm
150
300
450
600
0
2
RJA22
)
Analog Integrated Circuit Device Data
1 = Power Chip, 2 = Logic Chip
m = 1,
47.77
42.90
40.95
39.85
38.96
500
n = 1
Freescale Semiconductor
m = 1, n = 2
m = 2, n = 1
600
36.90
33.21
31.78
30.89
30.21
m = 2,
54.35
51.07
49.63
48.61
47.90
n = 2
(°C/W)