IR3082AMTRPBF International Rectifier, IR3082AMTRPBF Datasheet - Page 30
![IC XPHASE CONTROL 9.6V 20-MLPQ](/photos/7/48/74806/20_mlpq_sml.jpg)
IR3082AMTRPBF
Manufacturer Part Number
IR3082AMTRPBF
Description
IC XPHASE CONTROL 9.6V 20-MLPQ
Manufacturer
International Rectifier
Series
XPhase™r
Datasheet
1.IR3082AMTRPBF.pdf
(33 pages)
Specifications of IR3082AMTRPBF
Applications
Processor
Current - Supply
12mA
Voltage - Supply
8.05 V ~ 16 V
Operating Temperature
0°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
20-MLPQ
Ic Function
Control IC
Supply Voltage Range
8.05V To 16V
Operating Temperature Range
0°C To +100°C
Digital Ic Case Style
MLPQ
No. Of Pins
20
Filter Terminals
SMD
Supply Voltage Min
9.6V
Rohs Compliant
Yes
Controller Type
PWM
Frequency
1MHz
Package
20-Lead MLPQ
Circuit
X-Phase Control IC
Switch Freq (khz)
150kHz to 1.0MHz
Pbf
PbF Option Available
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IR3082AMTRPBFTR
METAL AND SOLDER RESIST
x The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
x The minimum solder resist width is 0.13mm, therefore it is recommended that the solder resist is
x At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
x The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
x Ensure that the solder resist in-between the lead lands and the pad land is
x The single via in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger than
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non
Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
completely removed from between the lead lands forming a single opening for each “group” of lead
lands.
fillet so a solder resist width of
the copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable
to have the solder resist opening for the land pad to be smaller than the part pad.
aspect ratio of the solder resist strip separating the lead lands from the pad land.
the diameter of the via.
Page 30 of 33
due to the high
05/02/2006
IR3082A