IR3510MTRPBF International Rectifier, IR3510MTRPBF Datasheet - Page 34

• Manufacturer Part Number: IR3510MTRPBF
• Description: IC XPHASE CONTROL 32-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase™r

Specifications of IR3510MTRPBF

• Applications: Processor
• Mounting Type: Surface Mount
• Package / Case: 32-MLPQ
• Package: 32-Lead MLPQ
• Circuit: X-Phase Control IC
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Other names: IR3510MTRPBFTR

SOLDER RESIST
• The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder resist
• The minimum solder resist width is 0.13mm.
• At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a fillet so a
• The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto the copper
• Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high aspect ratio of
• The four vias in the land pad should be tented or plugged from bottom board side with solder resist.
mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non Solder Mask
Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
solder resist width of ≥ 0.17mm remains.
of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable to have the solder
resist opening for the land pad to be smaller than the part pad.
the solder resist strip separating the lead lands from the pad land.
Page 34 of 36
IR Confidential
May 18, 2009
IR3510