ADN8831ACPZ-REEL7 Analog Devices Inc, ADN8831ACPZ-REEL7 Datasheet - Page 5

IC THERMO COOLER CTRLR 32LFCSP

ADN8831ACPZ-REEL7

Manufacturer Part Number
ADN8831ACPZ-REEL7
Description
IC THERMO COOLER CTRLR 32LFCSP
Manufacturer
Analog Devices Inc
Datasheet

Specifications of ADN8831ACPZ-REEL7

Applications
Thermoelectric Cooler
Current - Supply
8mA
Voltage - Supply
3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-LFCSP
Ic Function
Thermoelectric Cooler Controller
Supply Voltage Range
3V To 5.5V
Operating Temperature Range
-40°C To +85°C
Digital Ic Case Style
LFCSP
No. Of Pins
32
Msl
MSL 1 - Unlimited
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
ADN8831ACPZ-REEL7TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADN8831ACPZ-REEL7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings at 25°C, unless otherwise noted.
Table 2.
Parameter
Supply Voltage
Input Voltage
Storage Temperature Range
Operating Temperature Range
Operating Junction Temperature
Lead Temperature (Soldering, 60 sec)
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rating
6 V
GND to Vs + 0.3 V
−65°C to +150°C
−40°C to +85°C
125°C
300°C
Rev. 0 | Page 5 of 20
Stresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. This is a stress rating
only; functional operation of the device at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
THERMAL CHARACTERISTICS
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
32-lead LFCSP (ACP)
θ
JA
is specified for the worst-case conditions, that is, a device
θ
35
JA
θ
10
JC
ADN8831
Unit
°C/W

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