HCPL-800J-500 Avago Technologies US Inc., HCPL-800J-500 Datasheet - Page 4

• Manufacturer Part Number: HCPL-800J-500
• Description: IC PLC POWERLINE DAA 16-SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-800J-500

• Applications: Powerline Data Access
• Current - Supply: 28mA
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SO-16
• Supply Voltage Range: 4.75V To 5.25V
• Power Dissipation Pd: 1000mW
• Operating Temperature Range: -40°C To +85°C
• Digital Ic Case Style: SOIC
• No. Of Pins: 16
• Peak Reflow Compatible (260 C): No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Package Characteristics
All specifications and figures are at the nominal (typical) operating conditions of V
GND2 = 0 V and T
Notes:
1. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage
2. The Control IC-Line IC Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as a Control IC-Line IC
3. Device is considered as a two terminal device: pins 1 - 8 shorted together and pins 9 - 16 shorted together.
4. Maximum power dissipation in Control side and Line side IC’s needs to be limited to ensure that their respective junction temperature is less
Recommended PB-free IR Profile
Note: Non-halide flux should be used
4
25 ° C
Parameter
Control IC - Line IC Momentary
Withstand Voltage
Resistance (Control IC - Line IC)
Capacitance (Control IC - Line IC)
Control IC to Ambient Thermal
Resistance
Line IC to Ambient Thermal
Resistance
detection current limit, I
DIN EN 60747-5-2 Insulation Characteristics Table, if applicable.
continuous voltage rating. For the continuous voltage rating refer to your equipment level safety specification or IEC/EN/DIN EN 60747-5-2
Insulation Characteristics Table.
than 125°C. The maximum permissible power dissipation is dependent on the thermal impedance and the ambient temperature. Details on
the typical thermal impedances are given in the Package Characteristics. Further details on applying this to an actual application can be found
in the Application Information section under Thermal Considerations.
150 ° C
60 ~ 150 sec
A
= +25°C.
I-O
≤
200 ° C
5 µA). This test is performed before the 100% production test for partial discharge (method b) shown in IEC/EN/
217 ° C
Time (sec)
250 ° C
90 sec
60 sec
Symbol
V
R
C
θ
θ
IA
OA
ISO
I-O
I-O
260 ° C (Peak Temperature)
30 seconds
60 sec
Min.
3750
Typ.
>109
1.4
83
85
Max.
Units
V
Ω
pF
°C/W
rms
Test Conditions
RH< 50%, t = 1 min.,
T
V
f = 1 MHz
1 oz. trace, 2-layer PCB
Still air, T
A
I-O
≥
= 25°C
4500 Vrms for 1 second (leakage
= 500 Vdc
CC1
= 5 V, GND1 = 0 V, V
A
= 25°C
CC2
Note
1, 2, 3
3
4
= 5 V,