IR3529MTRPBF International Rectifier, IR3529MTRPBF Datasheet - Page 20
IR3529MTRPBF
Manufacturer Part Number
IR3529MTRPBF
Description
IC CTRL XPHASE CPU/ASIC 20-MLPQ
Manufacturer
International Rectifier
Series
XPhase3™r
Datasheet
1.IR3529MTRPBF.pdf
(22 pages)
Specifications of IR3529MTRPBF
Applications
Processor
Current - Supply
2mA
Voltage - Supply
8 V ~ 16 V
Operating Temperature
0°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
*
Package
20-Lead MLPQ
Circuit
X-Phase Phase IC
Iout (a)
4.0A Gate Driver
Pbf
PbF Option Available
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IR3529MTRPBFTR
Solder Resist
• The solder resist should be pulled away from the metal lead lands and center pad by a minimum of
• The minimum solder resist width is 0.13mm. At the inside corner of the solder resist where the lead land
• Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high aspect
• The 4 vias in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger than the
0.06mm. The solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead
lands are all Non Solder Mask Defined (NSMD). Therefore, pulling the S/R 0.06mm will always ensure
NSMD pads.
groups meet, it is recommended to provide a fillet so a solder resist width of ≥ 0.17mm remains.
ratio of the solder resist strip separating the lead lands from the pad land.
diameter of the via.
Page 20 of 22
February 12, 2010
IR3529