LM63CIMA/NOPB National Semiconductor, LM63CIMA/NOPB Datasheet - Page 7
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LM63CIMA/NOPB
Manufacturer Part Number
LM63CIMA/NOPB
Description
IC TEMP SENSR REMOTE DIODE 8SOIC
Manufacturer
National Semiconductor
Series
PowerWise®r
Datasheet
1.LM63CIMANOPB.pdf
(30 pages)
Specifications of LM63CIMA/NOPB
Function
Fan Control, Temp Monitor
Topology
ADC (Sigma Delta), Comparator, Fan Speed Control, Register Bank
Sensor Type
External & Internal
Sensing Temperature
0°C ~ 85°C, External Sensor
Output Type
SMBus™
Output Alarm
Yes
Output Fan
Yes
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Ic Output Type
Digital
Sensing Accuracy Range
± 1°C
Supply Current
1.3mA
Supply Voltage Range
3V To 3.6V
Resolution (bits)
11bit
Sensor Case Style
SOIC
No. Of Pins
8
Termination Type
SMD
Rohs Compliant
Yes
Filter Terminals
SMD
Accuracy %
1°C
For Use With
LM63EVAL - BOARD EVALUATION LM63
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*LM63CIMA
LM63CIMA
LM63CIMA
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: All voltages are measured with respect to GND, unless otherwise noted.
Note 3: When the input voltage (V
components and/or ESD protection circuitry are shown below for the LM63's pins. The nominal breakdown voltage of D3 is 6.5 V. Care should be taken not to
forward bias the parasitic diode, D1, present on pins D+ and D−. Doing so by more than 50 mV may corrupt temperature measurements. An "X" means it exists
in the circuit.
Note 4: Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin. See
ESD Protection Input Structure.
Note 5: Thermal resistance junction-to-ambient when attached to a printed circuit board with 2 oz. foil is 168°C/W.
Note 6: See the URL “http://www.national.com/packaging/” for other recommendations and methods of soldering surface mount devices.
Note 7: “Typicals” are at T
Note 8: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Note 9: The supply current will not increase substantially with an SMBus transaction.
Note 10: Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the internal power
dissipation of the LM63 and the thermal resistance. See
Note 11: The output rise time is measured from (V
Note 12: The output fall time is measured from (V
Note 13: Holding the SMBData and/or SMBCLK lines Low for a time interval greater than t
SMBDAT and SMBCLK pins to a high impedance state.
ALERT/Tach
Pin Name
SMBDAT
SMBCLK
PWM
V
D+
D−
DD
A
= 25°C and represent most likely parametric norm. They are to be used as general reference values not for critical design calculations.
PIN #
IN
) at any pin exceeds the power supplies (V
1
2
3
4
6
7
8
D1
X
X
IH min
IL max
FIGURE 1. ESD Protection Input Structure
+ 0.15 V) to (V
- 0.15 V) to (V
(Note
D2
X
X
X
X
X
X
5) for the thermal resistance to be used in the self-heating calculation.
D3
X
IL min
IH min
- 0.15 V).
+ 0.15 V).
IN
D4
7
X
< GND or V
D5
X
X
TIMEOUT
IN
> V+), the current at that pin should be limited to 5 mA. Parasitic
will reset the LM63’s SMBus state machine, therefore setting
D6
X
X
X
X
X
R1
X
X
X
X
20057005
SNP
X
X
X
X
Figure 1
ESD CLAMP
www.national.com
X
X
X
above for the