TC72-5.0MUATR Microchip Technology, TC72-5.0MUATR Datasheet - Page 18

SENSOR THERMAL SPI 5.0V 8MSOP

TC72-5.0MUATR

Manufacturer Part Number
TC72-5.0MUATR
Description
SENSOR THERMAL SPI 5.0V 8MSOP
Manufacturer
Microchip Technology
Datasheet

Specifications of TC72-5.0MUATR

Function
Temp Monitoring System (Sensor)
Topology
ADC (Sigma Delta), Register Bank
Sensor Type
Internal
Sensing Temperature
-55°C ~ 125°C
Output Type
SPI™
Output Alarm
No
Output Fan
No
Voltage - Supply
2.65 V ~ 5.5 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Full Temp Accuracy
3 C
Digital Output - Bus Interface
SPI
Digital Output - Number Of Bits
10 bit
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.6 V
Description/function
High Accuracy 10-bit Serial Output, 4-Wire SPI Interface
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Supply Current
400 uA
For Use With
TC72DM-PICTL - BOARD DEMO PICTAIL TC72
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
TC72
8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)
DS21743A-page 18
Z
Terminal Pitch
Terminal Land Pattern O.D.
Terminal Land Pattern I.D.
Exposed Pad Clearance
Interior Lead Clearance
Terminal Land Width
Terminal Land Length
Exposed Pad Length
Optional Exposed Pad Length
Exposed Pad Width
Termal Via Pitch
Thermal Via Diameter
Minimum Solder Mask Clearance
Drawing No. C04-2062
*Controlling Parameter
Notes:
1.
G
Exposed pad dimensions vary with paddle size.
CP
OPTIONAL TWO LAYER
DFN LAND PATTERN
PCB LAND PATTERN
X
Dimension Limits
H2
H
p
Units
CP
A1
H2
G2
P1
M
Z
Z
X
Y
H
V
p
G2
Y
MIN
.134
.057
.006
.071
.014
.033
.130
.130
.057
.002
M (TYP)
INCHES
.026 BSC
NOM
.047
.012
THERMAL VIAS
ON 4 LAYER
PC BOARD
MAX
TYPCAL SOLDER MASKS
.157
.060
.017
.035
.059
0V
OPTIONAL FOUR LAYER
P1
PCB LAND PATTERN
MIN
3.40
1.45
0.15
1.80
0.35
0.85
3.30
3.30
1.45
0.05
MILLIMETERS*
2002 Microchip Technology Inc.
0.65 BSC
NOM
1.20
0.30
MAX
4.00
1.53
0.42
0.88
1.50

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