AD780ARZ-REEL7 Analog Devices Inc, AD780ARZ-REEL7 Datasheet - Page 4

• Manufacturer Part Number: AD780ARZ-REEL7
• Description: IC VOLT REF PREC 2.5/3.0V 8SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD780ARZ-REEL7

• Temperature Coefficient: 7ppm/°C
• Design Resources: Using AD8599 as an Ultralow Distortion Driver for the AD7991 (CN0043) Using AD8599 as an Ultralow Distortion Driver for the AD7995 (CN0044) Using AD8599 as an Ultralow Distortion Driver for the AD7999 (CN0045) Using AD7328 in Appls with Single-Ended Industrial-Level Signals (CN0047) AD5382 Channel Monitor Function (CN0012) AD5383 Channel Monitor Function (CN0015) AD5390/91/92 Channel Monitor Function (CN0030) Measuring -48 V High-Side Current Using AD629, AD8603, AD780, and AD7453 (CN0100) High Voltage, High Precision Current Sensing with Output Level Shifting Using AD8210 and AD8274 (CN0116)
• Reference Type: Series and Shunt, Programmable
• Voltage - Output: 2.5V, 3V
• Tolerance: ±5mV
• Voltage - Input: 4 ~ 36 V
• Number Of Channels: 1
• Current - Quiescent: 1mA
• Current - Output: 10mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Topology: Series
• Input Voltage: 4V To 36V
• Reference Voltage: 2.5V
• Reference Voltage Tolerance: 5mV
• Voltage Reference Case Style: SOIC
• No. Of Pins: 8
• Fixed / Adjust / Prog: Programmable
• Output Voltage (max): 2.5/3V
• Reference Voltage Accuracy (max): 5
• Line Regulation: 10uV/V
• Load Regulation: 75uV/mA
• Input Voltage (max): 36V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC N
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Cathode: -
• Lead Free Status / Rohs Status: Compliant
• Other names: AD780ARZ-REEL7; AD780ARZ-REEL7TR

AD780
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
+V
TRIM Pin to Ground
TEMP Pin to Ground
Power Dissipation (25°C)
Storage Temperature
Lead Temperature
Output Protection
ESD Classification
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
conditions above those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum
specifications for extended periods may affect device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
(Soldering 10 sec)
IN
to Ground
Figure 2. Pin Configuration, 8-Lead PDIP and SOIC Packages
TEMP
GND
+V
NC
IN
1
2
3
4
NC = NO CONNECT
(Not to Scale)
TOP VIEW
AD780
36 V
Values
36 V
36 V
500 mW
−65°C to +150°C
300°C
Output safe for indefinite short to
ground and momentary short to V
Class 1 (1000 V)
8
7
6
5
2.5V/3.0V O/PSELECT
(NC OR GND)
NC
V
TRIM
OUT
Rev. E | Page 4 of 12
IN
.
NOTES
Both V
Die Thickness: The standard thickness of Analog Devices
bipolar dice is 24 mil ± 2 mil.
Die Dimensions: The dimensions given have a tolerance of
±2 mil.
Backing: The standard backside surface is silicon (not plated).
Analog Devices does not recommend gold-backed dice for most
applications.
Edges: A diamond saw is used to separate wafers into dice, thus
providing perpendicular edges halfway through the die. In
contrast to scribed dice, this technique provides a more uniform
die shape and size. The perpendicular edges facilitate handling
(such as tweezer pickup), while the uniform shape and size
simplify substrate design and die attach.
Top Surface: The standard top surface of the die is covered by a
layer of glassivation. All areas are covered except bonding pads
and scribe lines.
Surface Metallization: The metallization to Analog Devices
bipolar dice is aluminum. Minimum thickness is 10,000 Å.
Bonding Pads: All bonding pads have a minimum size of
4.0 mil by 6.0 mil. The passivation windows have a minimum
size of 3.6 mil by 5.6 mil.
TRIM
GND
OUT
pads should be connected to the output.
TEMP
Figure 3. Die Layout
V
OUT
+V
IN
O/P SELECT
2.5V/3.0V
GND